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MAC997A8RLRP

Onsemi

MAC997A8RLRP by Onsemi

MAC997A8RLRP by Onsemi is a single TRIAC with 600V repetitive peak off-state voltage, 0.8A max RMS on-state current, and 5mA max DC gate trigger current. Ideal for applications requiring precise AC power control in industrial equipment, lighting systems, and home appliances.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,847 parts In-Stock

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Digiode

USA . 1,013 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,359 parts In-Stock

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19,359

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SupplyDigital Components

Austria . 6,639 parts In-Stock

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Problanco Electronics

Mexico . 4,857 parts In-Stock

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Kulean Microsystems

USA . 3,542 parts In-Stock

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Corphita

USA . 1,116 parts In-Stock

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UHIMA Technologies

Türkiye . 934 parts In-Stock

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934

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TANS Electronics

Latvia . 384 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Upgrade your electronics with the MAC997A8RLRP by Onsemi, a top-quality TRIAC that delivers reliable performance in a variety of applications. Manufactured by Onsemi, a trusted name in the industry, this TRIAC is designed to provide seamless operation and durability. With a maximum RMS on-state current of 0.8 A and a repetitive peak off-state voltage of 600 V, this product offers exceptional value and benefits for customers seeking high-quality electronic components. Whether you're working on lighting controls, motor speed control, or other AC switching applications, the MAC997A8RLRP is the perfect choice for your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it easy to handle and long-lasting.

Maximum DC Gate Trigger Current: 5 mA

The low maximum DC gate trigger current requirement results in efficient and reliable operation of the TRIAC, consuming lower power and minimizing heat generation.

Configuration: SINGLE

Single configuration simplifies the setup and integration of the TRIAC into electronic circuits, reducing complexity and enhancing ease of use.

Package Shape: ROUND

The round package shape allows for easy mounting and installation in various applications, providing flexibility in design and placement.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables secure and stable connections, ensuring proper functioning of the TRIAC in different circuit configurations.

Maximum Leakage Current: 0.01 mA

The low maximum leakage current helps in maintaining the reliability and safety of the TRIAC by minimizing power loss and unwanted current flow.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and control in circuits, enabling efficient switching and regulation of power.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compactness and easy handling, making it suitable for applications where space is limited.

Maximum Operating Temperature: 110 °C

With a maximum operating temperature of 110 °C, the TRIAC can withstand high levels of heat, ensuring reliable performance under extreme conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC allows for precise and efficient triggering, making it suitable for a wide range of AC control applications.

Minimum Operating Temperature: -40 °C

The TRIAC can operate in sub-zero temperatures down to -40 °C, making it versatile for use in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures reliable connections, preventing corrosion and maintaining signal integrity for optimal performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and connection of the TRIAC, allowing for efficient heat dissipation and space-saving design.

Maximum RMS On-state Current: 0.8 A

The maximum RMS on-state current rating of 0.8 A enables the TRIAC to handle moderate to high power loads, making it suitable for a wide range of applications.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage requirement ensures efficient and reliable triggering of the TRIAC, allowing for precise control and switching operations.

Repetitive Peak Off-state Voltage: 600 V

The repetitive peak off-state voltage rating of 600 V provides a high level of insulation and protection against voltage spikes, making it suitable for power control applications.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

The minimum critical rate of rise of off-state voltage ensures fast and reliable switching performance, enhancing the efficiency and safety of the TRIAC.

Maximum Holding Current: 10 mA

The maximum holding current of 10 mA helps in maintaining the ON state of the TRIAC, ensuring stable operation and preventing unintended turn-off during operation.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997A8RLRP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997A8RLRP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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