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MAC97A6RLRP

Onsemi

MAC97A6RLRP by Onsemi

MAC97A6RLRP by Onsemi is a TRIAC with 3 terminals, max. DC gate trigger current of 5mA, and max. RMS on-state current of 0.6A. It is used in applications requiring a 4 quadrant logic level TRIAC for AC switching operations up to 400V and operating temperatures from -40 °C to 110°C.

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 252 parts In-Stock

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SupplyDigital Components

Austria . 6,261 parts In-Stock

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Kulean Microsystems

USA . 2,948 parts In-Stock

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TANS Electronics

Latvia . 2,507 parts In-Stock

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Problanco Electronics

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Corphita

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Corohmni

South Africa . 331 parts In-Stock

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UHIMA Technologies

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Overview

Discover the powerful MAC97A6RLRP Triode For Alternating Current (TRIAC) by Onsemi, a top-tier manufacturer known for quality and innovation. This versatile component is designed for a wide range of applications, offering seamless performance and reliability. With its exceptional features and benefits, including a maximum RMS On-state Current of 0.6 A and a Repetitive Peak Off-state Voltage of 400 V, this product delivers unparalleled value and efficiency to customers. Upgrade your projects with the MAC97A6RLRP and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the TRIAC, making it a reliable choice for various applications.

Maximum DC Gate Trigger Current: 5 mA

The low trigger current requirement of 5 mA allows for efficient and reliable operation of the TRIAC, ensuring smooth switching performance.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to incorporate the TRIAC into different electronic systems.

Package Shape: ROUND

The round package shape offers versatility in mounting options and space-saving benefits, making it suitable for compact designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure connection of the TRIAC to the circuit board, ensuring reliable electrical contact.

Maximum Leakage Current: 0.1 mA

The low maximum leakage current of 0.1 mA indicates minimal power loss when the TRIAC is in the off-state, contributing to energy efficiency.

No. of Terminals: 3

The three terminals provide the necessary connections for gate triggering and current flow, allowing for seamless integration into the circuit layout.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers a compact and space-efficient form factor, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 110 °C

With a maximum operating temperature of 110 °C, the TRIAC can withstand high temperature environments, ensuring reliable performance under varying conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level design allows for bidirectional current flow control, offering versatility in applications where both AC switching and phase control are required.

Minimum Operating Temperature: -40 °C

The wide temperature range starting from -40 °C enables the TRIAC to operate effectively in extreme cold conditions, expanding its utility in various environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable electrical performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and enhances heat dissipation, contributing to the overall efficiency and reliability of the TRIAC.

Maximum RMS On-state Current: 0.6 A

The maximum RMS on-state current rating of 0.6 A indicates the TRIAC's capability to handle moderate current loads, making it suitable for a wide range of applications.

Maximum DC Gate Trigger Voltage: 2 V

The low gate trigger voltage requirement of 2 V ensures efficient and reliable switching operation, allowing for precise control over the TRIAC's conduction state.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating of 400 V provides robust isolation and reliable off-state operation, making the TRIAC suitable for high-voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 25 V/us

The minimum critical rate of rise of off-state voltage of 25 V/us indicates the TRIAC's ability to respond quickly to changing voltage conditions, ensuring reliable and stable operation.

Maximum Holding Current: 10 mA

The maximum holding current of 10 mA ensures the TRIAC remains in the on-state even after the gate trigger current is removed, providing stable conduction for the desired duration.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC97A6RLRP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

25 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.1 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.6 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC97A6RLRP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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