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Z0409MF

STMicroelectronics

Z0409MF by STMicroelectronics

STMicroelectronics Z0409MF is a TRIAC with 600V repetitive peak off-state voltage, 0.95A max RMS on-state current, and 10mA max DC gate trigger current. Ideal for AC power control in applications like lighting dimmers, motor speed controllers, and heating control systems.

Median Price

$0.790

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 241 parts In-Stock

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$0.790

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Anansix

USA . 1,730 parts In-Stock

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Digiode

USA . 1,029 parts In-Stock

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Vyrian

USA . 702 parts In-Stock

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702

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Fibra_Brandt Electronic GMBH

Germany . 246 parts In-Stock

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ECAB

Sweden . 240 parts In-Stock

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240

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Holdelec - ElecDif-Pro

France . 72 parts In-Stock

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LittleDiode

UK . 19 parts In-Stock

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Manotoh

Italy . 1 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 37,607 parts In-Stock

1+ parts

$2.930

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37,607

$2.930

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Ampacity Inc.

Singapore . 814 parts In-Stock

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$3.100

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814

$3.100

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IDEA Electronic Components Group

UK . 1,538 parts In-Stock

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$3.772

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$3.395

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1,538

$3.772

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$3.395

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Corohmni

South Africa . 547 parts In-Stock

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$4.423

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547

$4.423

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MKK Technologies

India . 90 parts In-Stock

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$7.093

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90

$7.093

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DigiPath Technology Company

USA . 90 parts In-Stock

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$7.093

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$7.093

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Semicontronic

India . 572 parts In-Stock

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$9.100

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$8.872

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$8.827

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572

$9.100

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$8.827

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AZTECH Wire

Italy . 456 parts In-Stock

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$15.634

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456

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RC Electronics

USA . 52,373 parts In-Stock

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Kepictronics

USA . 31,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,803 parts In-Stock

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Continental Prestige Electronics

USA . 6,809 parts In-Stock

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Corphita

USA . 4,108 parts In-Stock

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Lixinc

USA . 3,456 parts In-Stock

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Argo Parts USA

USA . 3,106 parts In-Stock

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Parana Technologies

USA . 1,466 parts In-Stock

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$4.510

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$4.510

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Epart123

USA . 1,434 parts In-Stock

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Assy Fe

Spain . 192 parts In-Stock

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Bastille Electronics

Australia . 74 parts In-Stock

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Overview

The Z0409MF by STMicroelectronics sets the standard for excellence in TRIAC technology. Crafted with precision and expertise, this product offers unmatched quality and reliability for a variety of applications. From lighting controls to motor speed regulation, the Z0409MF delivers superior performance and efficiency. With its advanced features and robust design, customers can trust in the value and benefits that this TRIAC provides. Elevate your projects to new heights with the Z0409MF by STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the triode, making it a reliable choice.

Maximum DC Gate Trigger Current: 10 mA

With a high maximum DC gate trigger current, this triode can efficiently switch between on and off states, ensuring smooth operation.

Configuration: SINGLE

The single configuration simplifies the installation process and reduces the complexity of the circuit design, making it user-friendly.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and fitting in compact spaces, making it versatile for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and reduces the risk of disconnection, ensuring stability in operation.

Maximum Leakage Current: 0.2 mA

The low maximum leakage current minimizes power loss and improves the overall efficiency of the triode, making it cost-effective.

No. of Terminals: 3

With three terminals, this triode offers flexibility in circuit connection and functionality, making it adaptable to different requirements.

Package Style (Meter): IN-LINE

The in-line package style provides a streamlined and organized appearance, simplifying installation and maintenance processes.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in demanding environments, increasing the longevity of the triode.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level triac design enables precise control and switching capabilities, enhancing the overall performance of the product.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and enhances the conductivity of the terminals, ensuring stable connections.

Terminal Position: SINGLE

The single terminal position simplifies the wiring process and reduces the chance of errors, ensuring a hassle-free installation experience.

Maximum RMS On-state Current: 0.95 A

With a high maximum RMS on-state current, this triode can handle heavy loads and high currents efficiently, making it reliable for industrial applications.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage ensures smooth and reliable switching operations, improving the overall performance of the triode.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage allows the triode to withstand high voltages, making it suitable for a wide range of applications.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

The minimum critical rate of rise of off-state voltage ensures stable and consistent performance, reducing the risk of voltage spikes.

Maximum Holding Current: 15 mA

The high maximum holding current ensures that the triode remains in the on-state even under varying conditions, improving reliability and stability.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0409MF attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.95 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0409MF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

NSN

5961-01-606-9769, 5961016069769

NIIN

016069769

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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