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Z0402MF

STMicroelectronics

Z0402MF by STMicroelectronics

Z0402MF by STMicroelectronics is a TRIAC with 600V repetitive peak off-state voltage, 0.95A max RMS on-state current, and 3mA max DC gate trigger current. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lonics

Poland . 10,000 parts In-Stock

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Vyrian

USA . 3,626 parts In-Stock

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3,626

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Anansix

USA . 2,658 parts In-Stock

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2,658

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Digiode

USA . 130 parts In-Stock

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ECAB

Sweden . 23 parts In-Stock

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IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$3.900

100+ parts

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$3.510

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318

$3.900

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$3.510

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MKK Technologies

India . 311 parts In-Stock

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$7.333

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311

$7.333

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DigiPath Technology Company

USA . 311 parts In-Stock

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$7.333

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$7.333

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 8,333 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,974 parts In-Stock

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6,974

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Parana Technologies

USA . 1,279 parts In-Stock

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$4.663

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1,279

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$4.663

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Corphita

USA . 906 parts In-Stock

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Assy Fe

Spain . 30 parts In-Stock

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Overview

Discover the Z0402MF by STMicroelectronics, a high-quality TRIAC device designed for a wide range of applications. With a reputation for excellence, STMicroelectronics delivers unmatched reliability and performance. This versatile product offers customers exceptional value with its easy-to-use configuration and low leakage current. Ideal for a variety of projects, the Z0402MF provides precise and efficient control over AC circuits, making it an essential component for your next electronics endeavor. Choose STMicroelectronics for superior quality and innovation in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, extending the lifespan of the product.

Maximum DC Gate Trigger Current: 3 mA

Allows for precise and reliable triggering of the TRIAC, ensuring consistent performance.

Configuration: SINGLE

Simplified design for easier installation and operation.

Package Shape: RECTANGULAR

Facilitates easy mounting and integration into electronic circuits.

Terminal Form: THROUGH-HOLE

Provides better mechanical strength and stability when soldered onto a PCB.

Maximum Leakage Current: 0.2 mA

Ensures minimal power loss and energy efficiency during operation.

No. of Terminals: 3

Simplifies the connection process and reduces the chance of wiring errors.

Package Style (Meter): IN-LINE

Convenient form factor for easy installation and compatibility with various applications.

Maximum Operating Temperature: 125 °C

Allows the TRIAC to operate in a wide range of temperature environments, ensuring reliability and performance.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers versatility and compatibility with different control circuits and applications.

Minimum Operating Temperature: -40 °C

Allows the TRIAC to function in cold environments without any issues.

Terminal Finish: MATTE TIN

Provides a reliable and durable terminal finish for excellent solderability and electrical conductivity.

Terminal Position: SINGLE

Streamlines the wiring process and makes it easier to integrate into circuits.

Maximum RMS On-state Current: 0.95 A

Capable of handling high current loads, making it suitable for a variety of applications.

Maximum DC Gate Trigger Voltage: 2 V

Requires a low trigger voltage, which is ideal for low-power control circuits.

Repetitive Peak Off-state Voltage: 600 V

Can withstand high voltage spikes, ensuring protection for connected devices.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

Provides protection against fast voltage transients and switching events.

Maximum Holding Current: 10 mA

Ensures the TRIAC remains latched in the on-state during operation, preventing unintentional turn-off.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0402MF attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

3 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.95 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0402MF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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