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Z0107MN0

NXP Semiconductors

Z0107MN0 by NXP Semiconductors

Z0107MN0 by NXP Semiconductors is a single TRIAC with 4 terminals, capable of handling up to 1A RMS on-state current and 600V repetitive peak off-state voltage. It operates at a max temperature of 125°C and is designed as a surface-mount device for applications requiring 4-quadrant logic level triggering.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 8,000 parts In-Stock

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8,000

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Anansix

USA . 2,166 parts In-Stock

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2,166

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Vyrian

USA . 983 parts In-Stock

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983

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Digiode

USA . 570 parts In-Stock

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570

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$5.364

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409

$5.364

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One Stop Electronics

USA . 758 parts In-Stock

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$6.100

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758

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Ampacity Inc.

Singapore . 559 parts In-Stock

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$9.100

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559

$9.100

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Authorized Procurement Solutions

USA . 16,000 parts In-Stock

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16,000

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Lixinc

USA . 11,423 parts In-Stock

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Argo Parts USA

USA . 3,630 parts In-Stock

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3,630

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UNI Independent Distributors

Spain . 2,563 parts In-Stock

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Continental Prestige Electronics

USA . 1,542 parts In-Stock

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Corphita

USA . 1,378 parts In-Stock

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1,378

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Perfect Parts

USA . 151 parts In-Stock

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151

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the innovative Z0107MN0 by NXP Semiconductors, a high-quality Triode For Alternating Current (TRIAC) that offers exceptional performance and reliability. With NXP's reputation for excellence in semiconductor manufacturing, this product is designed to meet the demands of various applications. From lighting control to motor speed regulation, this TRIAC provides value and efficiency to customers seeking top-notch solutions for their projects. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for a variety of applications.

Configuration: SINGLE

Single configuration makes it easy to install and connect, simplifying the overall setup process.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape enables efficient placement on circuit boards and enhances the overall design aesthetics.

Terminal Form: GULL WING

Gull-wing terminals provide sturdy connections and facilitate soldering during assembly, ensuring reliable performance.

No. of Terminals: 4

Having 4 terminals allows for versatile connectivity options, enabling compatibility with a wide range of circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and is suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in a variety of environmental conditions, enhancing the product's reliability.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level TRIAC provides precise control over switching operations and enhances the overall efficiency of the product.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and corrosion resistance, improving the product's longevity.

Terminal Position: DUAL

Dual terminal position allows for flexible installation options and enables easy integration into different circuit configurations.

Maximum RMS On-state Current: 1 A

High maximum RMS on-state current rating allows the product to handle larger loads and ensures consistent performance under heavy usage.

Case Connection: MAIN TERMINAL 2

Main terminal 2 for case connection provides a secure grounding point, enhancing the product's safety and reliability.

Repetitive Peak Off-state Voltage: 600 V

High repetitive peak off-state voltage rating ensures effective isolation and protection against voltage spikes, making the product suitable for demanding applications.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0107MN0 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1 A

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0107MN0 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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