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MAC9DG

Onsemi

MAC9DG by Onsemi

MAC9DG by Onsemi is a TRIAC with 3 terminals, max. DC gate trigger current of 50mA, and max. RMS on-state current of 8A. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems due to its high operating temperature range (-40 to 125°C) and repetitive peak off-state voltage of 400V.

Median Price

$2.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,416 parts In-Stock

1+ parts

$2.500

100+ parts

$1.090

1k+ parts

$0.802

10k+ parts

$0.743

1,416

$2.500

$1.090

$0.802

$0.743

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,967 parts In-Stock

1+ parts

$1.492

100+ parts

-

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1,967

$1.492

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Vyrian

USA . 1,052 parts In-Stock

1+ parts

$1.570

100+ parts

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1,052

$1.570

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North Shore Components

USA . 1,137 parts In-Stock

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1,137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,136 parts In-Stock

1+ parts

$1.330

100+ parts

-

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2,136

$1.330

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Corphita

USA . 2,473 parts In-Stock

1+ parts

$1.413

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2,473

$1.413

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Corohmni

South Africa . 169 parts In-Stock

1+ parts

$1.570

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169

$1.570

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Problanco Electronics

Mexico . 8,097 parts In-Stock

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8,097

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SupplyDigital Components

Austria . 7,710 parts In-Stock

1+ parts

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7,710

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TANS Electronics

Latvia . 7,628 parts In-Stock

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7,628

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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A-Z Elektronik GmbH

Germany . 6,603 parts In-Stock

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6,603

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Alle Elektronik GmbH

Germany . 4,402 parts In-Stock

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4,402

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Kulean Microsystems

USA . 3,348 parts In-Stock

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3,348

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Perfect Parts

USA . 1,457 parts In-Stock

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1,457

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UHIMA Technologies

Türkiye . 505 parts In-Stock

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505

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Overview

Discover the MAC9DG by Onsemi, a high-quality TRIAC perfect for various applications. With a reliable manufacturer like Onsemi, you can trust in the durability and performance of this product. The MAC9DG offers customers value through its ease of use, versatility, and efficiency. Whether you're looking to control power in lighting, heating, or motor speed applications, this TRIAC is the ideal solution. Upgrade your systems with the MAC9DG and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material used in the package body provides durability and protection to the internal components of the TRIAC, ensuring reliable performance over time.

Maximum DC Gate Trigger Current: 50 mA

The high maximum DC Gate Trigger Current of 50 mA allows for efficient triggering of the TRIAC, ensuring quick and reliable switching of alternating current.

Configuration: SINGLE

The single configuration simplifies installation and usage of the TRIAC, making it user-friendly and easy to integrate into various electronic applications.

Maximum Leakage Current: 2 mA

The low maximum Leakage Current of 2 mA indicates minimal power loss when the TRIAC is in the off-state, leading to energy efficiency and reduced heat generation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this TRIAC can withstand high temperatures, making it suitable for use in a wide range of industrial and commercial applications.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC9DG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC9DG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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