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MAC97A6RLRPG

Onsemi

MAC97A6RLRPG by Onsemi

MAC97A6RLRPG by Onsemi is a TRIAC with 3 terminals, max. DC gate trigger current of 5mA, and max. RMS on-state current of 0.6A. It operates b/w -40 to 110 °C, suitable for applications requiring a 4 quadrant logic level TRIAC like dimmers and motor speed control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,419 parts In-Stock

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Digiode

USA . 732 parts In-Stock

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732

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Ampacity Inc.

Singapore . 1,239 parts In-Stock

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$10.100

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$10.100

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AZTECH Wire

Italy . 1,099 parts In-Stock

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$18.880

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Perfect Parts

USA . 12,980 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,006 parts In-Stock

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9,006

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Kulean Microsystems

USA . 4,769 parts In-Stock

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4,769

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,478 parts In-Stock

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SupplyDigital Components

Austria . 1,764 parts In-Stock

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UHIMA Technologies

Türkiye . 876 parts In-Stock

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Corphita

USA . 440 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Problanco Electronics

Mexico . 73 parts In-Stock

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Overview

Discover the MAC97A6RLRPG by Onsemi, a top-quality TRIAC perfect for a wide range of applications. With a reputation for excellence, Onsemi delivers reliability and innovation that sets them apart. This versatile device offers customers value, efficiency, and peace of mind. Whether you're looking for a reliable solution for your lighting control system or need a dependable component for your heating equipment, the MAC97A6RLRPG is the answer. Trust Onsemi to provide the quality and performance you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and less prone to damage during handling and installation.

Maximum DC Gate Trigger Current: 5 mA

With a low trigger current requirement, the product can be easily controlled and triggered, allowing for precise and efficient operation.

Configuration: SINGLE

The single configuration simplifies the setup and usage of the product, making it user-friendly and suitable for various applications.

Package Shape: ROUND

The round shape of the package allows for easy mounting and installation in different devices or systems.

Maximum Leakage Current: 0.1 mA

The low leakage current ensures minimal power loss and efficient performance of the product, leading to energy savings.

No. of Terminals: 3

Having three terminals provides flexibility in connecting the product to different circuits or devices, allowing for versatile usage.

Package Style: CYLINDRICAL

The cylindrical package style makes the product compact and space-saving, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, ensuring reliable performance in various environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRAIC allows for bidirectional control of AC power, making the product suitable for a wide range of AC power applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper ensures good conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Maximum RMS On-state Current: 0.6 A

With a high maximum RMS on-state current rating, the product can handle higher loads, making it suitable for applications requiring higher current ratings.

Maximum DC Gate Trigger Voltage: 2 V

The low gate trigger voltage requirement of 2V enables easy triggering of the product, ensuring efficient and reliable performance.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating of 400V makes the product suitable for applications requiring high voltage handling capabilities.

Maximum Holding Current: 10 mA

The maximum holding current of 10mA ensures stable operation of the product once triggered, preventing unintended turn-off and ensuring continuous performance.

Peak Reflow Temperature: 260

The high peak reflow temperature of 260 °C enables the product to withstand reflow soldering processes, ensuring robust and reliable soldering connections during assembly.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC97A6RLRPG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.1 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

.6 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC97A6RLRPG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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