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MAC223A-6G

Onsemi

MAC223A-6G by Onsemi

MAC223A-6G by Onsemi is a single TRIAC with 25A RMS current and 400V repetitive peak off-state voltage. Ideal for AC power control applications, it features a plastic/epoxy body, through-hole terminals, and a flange mount package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,349 parts In-Stock

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1,349

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Vyrian

USA . 461 parts In-Stock

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461

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Problanco Electronics

Mexico . 8,241 parts In-Stock

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8,241

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SupplyDigital Components

Austria . 8,128 parts In-Stock

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Kulean Microsystems

USA . 6,650 parts In-Stock

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6,650

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TANS Electronics

Latvia . 3,282 parts In-Stock

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UHIMA Technologies

Türkiye . 924 parts In-Stock

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924

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Corphita

USA . 230 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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Overview

Enhance your electronic designs with the MAC223A-6G by Onsemi, a high-quality TRIAC perfect for a wide range of applications. Onsemi is known for its reliable and innovative products, making this TRIAC a smart choice for your projects. With a maximum RMS On-state Current of 25A and a Repetitive Peak Off-state Voltage of 400V, the MAC223A-6G offers superior performance and durability. Whether you're working on lighting controls, motor speed controls, or heating equipment, this TRIAC will deliver the precision and efficiency you need. Upgrade your designs today with the MAC223A-6G from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Configuration: SINGLE

The single configuration simplifies the installation process and reduces the chances of errors.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space in the circuit.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and make it easy to solder the component onto the circuit board.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into the circuit design.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and ensures that the component stays securely in place.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The use of a 4-quadrant logic level TRIAC ensures precision control over the switching operation, making it suitable for a wide range of applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and reduces the chances of wiring errors.

Maximum RMS On-state Current: 25 A

With a maximum on-state current of 25 A, this TRIAC can handle high loads without any issues, making it suitable for various high-power applications.

Case Connection: MAIN TERMINAL 2

The case connection at main terminal 2 ensures proper grounding and helps in dissipating heat effectively, increasing the overall efficiency of the component.

Repetitive Peak Off-state Voltage: 400 V

The 400 V repetitive peak off-state voltage allows the TRIAC to withstand high voltages, making it reliable and safe for use in different electrical circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC223A-6G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

MAC223A-6G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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