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MAC218-4

Onsemi

MAC218-4 by Onsemi

MAC218-4 by Onsemi is a TRIAC with 200V repetitive peak off-state voltage and 8A max RMS on-state current. It has a 2V max on-state voltage and operates b/w -40 °C to 125°C. Ideal for AC power control applications requiring up to 50mA DC gate trigger current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,206 parts In-Stock

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Digiode

USA . 1,619 parts In-Stock

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Problanco Electronics

Mexico . 8,366 parts In-Stock

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TANS Electronics

Latvia . 7,577 parts In-Stock

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Kulean Microsystems

USA . 3,934 parts In-Stock

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Corphita

USA . 1,427 parts In-Stock

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UHIMA Technologies

Türkiye . 930 parts In-Stock

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SupplyDigital Components

Austria . 881 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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Overview

The MAC218-4 by Onsemi is a high-quality TRIAC designed to meet the demands of various applications. With its reliable performance, the manufacturer's reputation for excellence shines through in this product. Whether used in lighting controls, motor speed controls, or heating equipment, this TRIAC provides exceptional value and benefits to customers. Say goodbye to worries about efficiency and reliability with the MAC218-4, an essential component for your electronic projects.

Feature Benefit Bullets

Maximum On-state Voltage: 2 V

Low on-state voltage allows for efficient operation and minimizes power loss.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside.

Maximum DC Gate Trigger Current: 50 mA

Relatively high gate trigger current ensures reliable switching of the TRIAC.

Configuration: SINGLE

Single configuration simplifies installation and wiring of the device.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections on a circuit board.

Maximum Leakage Current: 2 mA

Low leakage current ensures minimal power wastage when the device is in the off-state.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low off-state leakage current helps in maintaining the efficiency of the circuit.

No. of Terminals: 3

Having three terminals allows for versatile connectivity options.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy mounting and installation in various applications.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in harsh environments.

Trigger Device Type: TRIAC

Being a TRIAC, this device is suitable for AC power control applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity.

Terminal Position: SINGLE

Single terminal position simplifies the wiring process.

Maximum RMS On-state Current: 8 A

High on-state current rating allows for handling of large AC loads.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage ensures efficient switching of the device.

Case Connection: MAIN TERMINAL 2

Case connection at main terminal 2 provides easy access for external connections.

Repetitive Peak Off-state Voltage: 200 V

High off-state voltage capability allows for reliable performance in AC power control circuits.

Maximum Holding Current: 50 mA

High holding current ensures the TRIAC remains in the on-state even in noisy environments.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC218-4 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Voltage:

2 V

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC218-4 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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