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MAC997A8

Onsemi

MAC997A8 by Onsemi

MAC997A8 by Onsemi is a TRIAC with 600V repetitive peak off-state voltage and 0.8A max RMS on-state current. It operates b/w -40 to 110 °C, with a 5mA max DC gate trigger current. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,625 parts In-Stock

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Digiode

USA . 323 parts In-Stock

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323

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Kulean Microsystems

USA . 8,159 parts In-Stock

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8,159

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Problanco Electronics

Mexico . 2,992 parts In-Stock

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SupplyDigital Components

Austria . 1,692 parts In-Stock

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Corphita

USA . 1,591 parts In-Stock

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TANS Electronics

Latvia . 689 parts In-Stock

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UHIMA Technologies

Türkiye . 263 parts In-Stock

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Corohmni

South Africa . 113 parts In-Stock

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Overview

Unleash the power of innovation with the MAC997A8 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. The MAC997A8, a Triode For Alternating Current (TRIAC), offers unmatched reliability and performance in a variety of applications. With a maximum RMS On-state current of 0.8 A and a repetitive peak off-state voltage of 600 V, this product is designed to provide seamless operation. Trust Onsemi for cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Maximum DC Gate Trigger Current: 5 mA

The low maximum DC gate trigger current requirement allows for efficient and reliable switching of the TRIAC, making it suitable for a wide range of control applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it user-friendly and cost-effective.

Package Shape: ROUND

The round package shape ensures easy mounting and handling, making it convenient for integration into different systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, enhancing the overall reliability and performance of the product.

Maximum Leakage Current: 0.01 mA

The low maximum leakage current minimizes power loss and enhances the efficiency of the TRIAC, making it an energy-efficient choice for various applications.

No. of Terminals: 3

The 3 terminals provide flexibility in circuit design and enable easy connectivity, making it suitable for a variety of control and switching applications.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compactness and easy installation, making it suitable for applications where space is limited.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature tolerance allows the TRIAC to function effectively in harsh environmental conditions, ensuring reliability and longevity.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC provides precise control and accurate switching, making it suitable for a wide range of AC control applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance enables the TRIAC to operate effectively in extreme cold conditions, making it versatile for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: BOTTOM

The bottom terminal position allows for easy installation and connection, enhancing the usability and convenience of the product.

Maximum RMS On-state Current: 0.8 A

The high maximum RMS on-state current rating allows the TRIAC to handle heavy loads and high current applications, making it versatile for a wide range of industrial and residential uses.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage requirement ensures efficient and reliable triggering of the TRIAC, making it suitable for precision control applications.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage rating allows the TRIAC to withstand high voltage spikes and surges, making it reliable and durable in various power control applications.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

The minimum critical rate of rise of off-state voltage ensures fast and efficient response to voltage changes, enhancing the overall performance and reliability of the product.

Maximum Holding Current: 10 mA

The high maximum holding current ensures stable operation and prevents false triggering, making the TRIAC reliable in various control applications.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997A8 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997A8 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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