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MCR08DT1

Onsemi

MCR08DT1 by Onsemi

MCR08DT1 by Onsemi is a TRIAC with max on-state voltage of 1.7V, DC gate trigger current of 0.2mA, and RMS on-state current of 0.8A. Ideal for AC power control applications due to its high operating temp range (-40 to 110 °C) and repetitive peak off-state voltage of 400V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,250 parts In-Stock

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Digiode

USA . 1,171 parts In-Stock

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Semi Source

USA . 8 parts In-Stock

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TANS Electronics

Latvia . 4,779 parts In-Stock

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Problanco Electronics

Mexico . 4,282 parts In-Stock

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Kulean Microsystems

USA . 3,676 parts In-Stock

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Corohmni

South Africa . 333 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 181 parts In-Stock

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UHIMA Technologies

Türkiye . 60 parts In-Stock

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Overview

Discover the high-quality MCR08DT1 TRIAC by Onsemi, designed to deliver reliable performance for a wide range of applications. With its surface mount capability and impressive specifications, this TRIAC is ideal for controlling power in various electronic devices. Trust in Onsemi's reputation for excellence and innovation, as this product offers unparalleled value, benefits, and advantages to customers seeking top-notch components. Upgrade your projects with the MCR08DT1 and experience the difference in quality and performance.

Feature Benefit Bullets

Maximum On-state Voltage: 1.7 V

Low on-state voltage helps in reducing power loss and improving efficiency of the product.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current ensures efficient switching of the TRIAC.

Surface Mount: Yes

Surface mount feature makes installation easier and saves space on the PCB.

Maximum Leakage Current: 0.2 mA

Low leakage current helps in minimizing power consumption and enhancing reliability.

Maximum Operating Temperature: 110 °C

Wide operating temperature range makes the product suitable for various environmental conditions.

Trigger Device Type: TRIAC

TRIAC technology allows for bidirectional control of AC power which is essential for many applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in extremely cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and ensures reliable connections.

Maximum RMS On-state Current: 0.8 A

High RMS on-state current rating allows the product to handle high current loads efficiently.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage ensures precise and reliable triggering of the TRIAC.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating allows the product to withstand high voltage spikes.

Minimum Critical Rate of Rise of Off-state Voltage: 10 V/us

High critical rate of rise of off-state voltage rating ensures proper protection against voltage transients.

Maximum Holding Current: 5 mA

High holding current ensures the TRIAC remains in the on-state even in the presence of noise or disturbances.

Technical Specifications

Triode For Alternating Current (TRIAC) MCR08DT1 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-609 Code:

e0

Maximum Leakage Current:

.2 mA

Maximum On-state Voltage:

1.7 V

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Trigger Device Type:

Trade Compliance

MCR08DT1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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