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MAC218A6FP

Onsemi

MAC218A6FP by Onsemi

MAC218A6FP by Onsemi is a single TRIAC with 8A max RMS on-state current, 400V repetitive peak off-state voltage, and 50mA max DC gate trigger current. It is used in applications requiring isolated case connection, such as motor control systems and lighting dimmers.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 732 parts In-Stock

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Digiode

USA . 177 parts In-Stock

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Distributors (Availability)

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kulean Microsystems

USA . 7,502 parts In-Stock

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Problanco Electronics

Mexico . 6,741 parts In-Stock

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TANS Electronics

Latvia . 6,073 parts In-Stock

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SupplyDigital Components

Austria . 5,678 parts In-Stock

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Corphita

USA . 1,741 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Corohmni

South Africa . 348 parts In-Stock

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Overview

Discover the MAC218A6FP by Onsemi, a top-notch Triode For Alternating Current (TRIAC) that guarantees superior performance and reliability. Manufactured by Onsemi, a trusted industry leader, this product offers customers unmatched value and benefits. Ideal for a wide range of applications, this TRIAC is versatile and efficient. With its high-quality construction and innovative design, the MAC218A6FP is the perfect choice for all your electronic needs. Experience the difference with Onsemi's MAC218A6FP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures a lightweight and durable construction, making this product easy to handle and resistant to damage.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum DC gate trigger current of 50 mA, this TRIAC is capable of reliable and efficient triggering, ensuring stable performance in different applications.

Configuration: SINGLE

The single configuration simplifies the setup and installation process, making it easier for users to integrate this TRIAC into their systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement within a circuit or system, helping to optimize space and improve overall efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection, reducing the risk of disconnection and ensuring stable performance over time.

Maximum Leakage Current: 2 mA

The low maximum leakage current of 2 mA helps to enhance energy efficiency and minimize power loss, making this TRIAC a cost-effective choice for various applications.

No. of Terminals: 3

The three terminals offer versatility in connectivity options, allowing for flexible integration into different circuit configurations and systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates easy and secure mounting, ensuring stability and reliability in various operating environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this TRIAC can withstand elevated temperatures, providing reliable performance in demanding conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC design enables precise control and operation in both positive and negative cycles, making this product suitable for a wide range of AC switching applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in cold environments, making this TRIAC suitable for a variety of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish enhances conductivity and corrosion resistance, improving the overall longevity and reliability of this TRIAC.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and ensures consistent connectivity, providing ease of use for users.

Maximum RMS On-state Current: 8 A

With a high maximum RMS on-state current of 8 A, this TRIAC is capable of handling heavy loads and high-power applications with ease.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage of 2 V ensures efficient and reliable triggering, reducing power consumption and improving overall performance.

Case Connection: ISOLATED

The isolated case connection helps to prevent electrical interference and ensure safe operation, making this TRIAC suitable for sensitive electronic applications.

Repetitive Peak Off-state Voltage: 400 V

The repetitive peak off-state voltage of 400 V provides reliable protection against voltage surges and transient events, ensuring the safety of connected devices.

Maximum Holding Current: 50 mA

With a maximum holding current of 50 mA, this TRIAC can maintain its state without external triggering, offering reliable performance in various applications.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this TRIAC meets stringent safety and quality standards, providing peace of mind to users regarding its performance and reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC218A6FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC218A6FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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