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TIC253D

Texas Instruments

TIC253D by Texas Instruments

TIC253D by Texas Instruments is a single TRIAC with 3 terminals, featuring a max RMS on-state current of 20A and repetitive peak off-state voltage of 400V. It operates b/w -40 to 110°C, with a max DC gate trigger current of 50mA. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

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Vyrian

USA . 7,729 parts In-Stock

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Digiode

USA . 1,862 parts In-Stock

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ACDS - Activité Composants Distribution Service

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700

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Holdelec - ElecDif-Pro

France . 76 parts In-Stock

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ECAB

Sweden . 64 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 30 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

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Huijzer Components

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LittleDiode

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Parana Technologies

USA . 760 parts In-Stock

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$2.262

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$2.763

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DigiPath Technology Company

USA . 295 parts In-Stock

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$2.491

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ChromeModa Solutions

Germany . 5,853 parts In-Stock

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IDEA Electronic Components Group

UK . 629 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 575 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Overview

Upgrade your electronics with the high-quality TIC253D TRIAC by Texas Instruments! This versatile component offers a wide range of applications, making it perfect for various projects. From home automation to industrial machinery control, this TRIAC provides reliable performance and efficiency. Trust in Texas Instruments' reputation for innovation and excellence, and experience the value and benefits that the TIC253D brings to your designs. Elevate your creations with this top-of-the-line component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability in various operating conditions.

Maximum DC Gate Trigger Current: 50 mA

Allows for efficient triggering of the TRIAC under different voltage conditions, making it versatile for a range of applications.

Configuration: SINGLE

Simplifies the wiring and connection process, making it easier to integrate into circuits.

Package Shape: RECTANGULAR

Offers a compact design that can fit easily into different electronic devices and applications.

Maximum Leakage Current: 2 mA

Ensures minimal power loss when the TRIAC is in the off-state, enhancing energy efficiency.

No. of Terminals: 3

Provides the necessary connection points for effective operation and control of the TRIAC.

Package Style (Meter): FLANGE MOUNT

Facilitates easy installation and mounting of the TRIAC, enhancing user convenience.

Maximum Operating Temperature: 110 °C

Allows the TRIAC to operate reliably in high-temperature environments without compromising performance.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Supports bidirectional control of AC power, making it suitable for a wide range of AC switching applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extremely cold environments, offering versatile usage capabilities.

Maximum RMS On-state Current: 20 A

Can handle high current loads, making it suitable for applications that require significant power handling capabilities.

Maximum DC Gate Trigger Voltage: 2.5 V

Allows for reliable and efficient triggering of the TRIAC with low voltage inputs.

Case Connection: MAIN TERMINAL 2

Facilitates easy connection to the main terminal, ensuring proper functionality and performance.

Repetitive Peak Off-state Voltage: 400 V

Withstands high voltage levels, making it suitable for applications that require reliable voltage switching.

Maximum Holding Current: 50 mA

Ensures stable operation of the TRIAC once triggered, providing consistent performance under varying conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC253D attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC253D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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