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2N6071AT

Onsemi

2N6071AT by Onsemi

2N6071AT by Onsemi is a TRIAC with 4A RMS on-state current, 5mA DC gate trigger current, and 200V repetitive peak off-state voltage. It operates b/w -40 to 150 °C and is ideal for applications requiring precise AC power control such as dimmers and motor speed controllers.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,289 parts In-Stock

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Vyrian

USA . 2,223 parts In-Stock

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Northwest PG Solutions

USA . 1,842 parts In-Stock

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$0.262

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$0.231

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Native Components

USA . 1,096 parts In-Stock

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$0.335

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$0.321

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$0.335

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$0.321

Problanco Electronics

Mexico . 3,611 parts In-Stock

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Corphita

USA . 2,178 parts In-Stock

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SupplyDigital Components

Austria . 1,756 parts In-Stock

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TANS Electronics

Latvia . 1,675 parts In-Stock

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UHIMA Technologies

Türkiye . 383 parts In-Stock

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Kulean Microsystems

USA . 305 parts In-Stock

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Corohmni

South Africa . 182 parts In-Stock

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Overview

Discover the power of the 2N6071AT by Onsemi, a high-quality TRIAC designed to revolutionize your electronic projects. With Onsemi's reputation for excellence in manufacturing, this triode offers unmatched reliability and performance. Ideal for a wide range of applications, this device is perfect for controlling AC power in lighting, heating, and motor control systems. Experience the value and benefits of seamless operation, precise control, and efficient energy management with the 2N6071AT - your ultimate solution for all your TRIAC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to heat, making it suitable for a variety of operating conditions.

Maximum DC Gate Trigger Current: 5 mA

The high maximum DC gate trigger current of 5 mA ensures reliable and consistent performance in triggering the TRIAC.

Configuration: SINGLE

The single configuration simplifies the wiring and installation process, making it easy to integrate into different systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and space-saving mounting on a PCB or other surfaces.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ensuring stable operation of the TRIAC.

Maximum Leakage Current: 2 mA

The low maximum leakage current of 2 mA helps in maintaining the efficiency and reliability of the TRIAC.

No. of Terminals: 3

Having 3 terminals offers flexibility in connection options and ensures proper functioning in a circuit.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and secure attachment to a surface or heatsink for efficient heat dissipation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C enables the TRIAC to function reliably in high-temperature environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC provides precise control over triggering and ensures compatibility with various control systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the TRIAC to operate effectively in cold environments without losing performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides corrosion resistance and ensures good electrical conductivity, prolonging the lifespan of the TRIAC.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and ensures consistent performance in the circuit.

Maximum RMS On-state Current: 4 A

The high maximum RMS on-state current of 4 A allows the TRIAC to handle high current loads efficiently and reliably.

Maximum DC Gate Trigger Voltage: 2.5 V

The low maximum DC gate trigger voltage of 2.5 V enables easy triggering and control of the TRIAC in various applications.

Repetitive Peak Off-state Voltage: 200 V

The repetitive peak off-state voltage of 200 V ensures that the TRIAC can withstand voltage fluctuations and surges during operation.

Maximum Holding Current: 30 mA

The high maximum holding current of 30 mA ensures stable operation and prevents false triggering of the TRIAC.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C allows for safe and effective soldering during assembly, ensuring the reliability of the connection.

Technical Specifications

Triode For Alternating Current (TRIAC) 2N6071AT attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

30 mA

JEDEC-95 Code:

TO-225

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

2N6071AT Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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