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MAC8N

Onsemi

MAC8N by Onsemi

MAC8N by Onsemi is a TRIAC with 3 terminals, max. RMS on-state current of 8A, and max. DC gate trigger voltage of 1.5V. It is used in applications requiring AC switching such as dimmers, motor speed control, and heating control systems.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 40 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

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$2.500

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40

$3.850

$2.880

$2.500

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Digiode

USA . 1,677 parts In-Stock

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Vyrian

USA . 1,156 parts In-Stock

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Bristol Electronics

USA . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 70 parts In-Stock

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70

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PC Components Company LLC

USA . 35 parts In-Stock

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35

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Nova Conductors

Japan . 31 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 64 parts In-Stock

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$3.850

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64

$3.850

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Ampacity Inc.

Singapore . 1,133 parts In-Stock

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$26.100

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$26.100

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Kepictronics

USA . 27,860 parts In-Stock

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SupplyDigital Components

Austria . 8,309 parts In-Stock

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TANS Electronics

Latvia . 2,894 parts In-Stock

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Kulean Microsystems

USA . 2,737 parts In-Stock

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2,737

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Problanco Electronics

Mexico . 2,301 parts In-Stock

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Corphita

USA . 1,407 parts In-Stock

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Assy Fe

Spain . 9 parts In-Stock

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Overview

Experience the power of the MAC8N from Onsemi, a top-quality TRIAC that offers superior performance and reliability. Designed with precision and expertise, this product is ideal for a wide range of applications. From lighting control to motor speed regulation, the MAC8N delivers exceptional value and benefits to customers seeking efficiency and durability in their electronic devices. Trust Onsemi for cutting-edge technology and unparalleled customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Maximum DC Gate Trigger Current: 35 mA

The high maximum DC gate trigger current allows for efficient and reliable triggering of the TRIAC.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to solder the TRIAC onto a circuit board for secure connections.

Maximum Leakage Current: 2 mA

The low maximum leakage current ensures minimal power loss when the TRIAC is in the off-state.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage allows the TRIAC to handle high voltage applications with ease.

Maximum Holding Current: 40 mA

The high maximum holding current ensures the TRIAC remains in the on-state reliably without false triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC8N attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

250 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

40 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

MAC8N Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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