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BTA316-800B0

NXP Semiconductors

BTA316-800B0 by NXP Semiconductors

The NXP Semiconductors BTA316-800B0 is a TRIAC with 16A RMS current and 800V repetitive peak off-state voltage. It features a single configuration, through-hole terminals, and operates at up to 125°C. Ideal for applications requiring precise switching control in AC circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,878 parts In-Stock

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Anansix

USA . 2,603 parts In-Stock

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VNN

France . 784 parts In-Stock

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Vyrian

USA . 497 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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One Stop Electronics

USA . 979 parts In-Stock

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AZTECH Wire

Italy . 506 parts In-Stock

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Ampacity Inc.

Singapore . 1,242 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 4,874 parts In-Stock

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Continental Prestige Electronics

USA . 4,495 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Upgrade your electronic designs with the BTA316-800B0 from NXP Semiconductors, a leading manufacturer known for quality and reliability. This TRIAC device offers seamless control of alternating current, making it ideal for a wide range of applications. With its high maximum RMS on-state current and repetitive peak off-state voltage, this product provides exceptional performance and efficiency. Trust in NXP Semiconductors to deliver cutting-edge technology that will enhance your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a longer lifespan.

Configuration: SINGLE

The single configuration simplifies installation and reduces wiring complexity, making it easier to integrate into circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy mounting, making it suitable for compact applications.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in various environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the TRIAC can withstand elevated temperatures, improving its overall robustness and reliability.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC allows for precise and efficient control of alternating current, making it suitable for a wide range of applications.

Maximum RMS On-state Current: 16 A

With a maximum RMS on-state current of 16A, this TRIAC can handle high current loads, making it ideal for heavy-duty applications.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage of 800V ensures reliable operation and protection against voltage surges, making it a safe choice for various applications.

Technical Specifications

Triode For Alternating Current (TRIAC) BTA316-800B0 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTA316-800B0 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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