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BTA310-800D,127

NXP Semiconductors

BTA310-800D,127 by NXP Semiconductors

BTA310-800D,127 TRIAC from NXP Semiconductors features a max on-state voltage of 1.5 V and can handle up to 10 A RMS current. With a peak off-state voltage of 800 V, it operates efficiently in high-temperature environments up to 150 °C. Ideal for AC control applications, it ensures reliable performance with minimal leakage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Anansix

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One Stop Electronics

USA . 1,049 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,526 parts In-Stock

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Corphita

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UNI Independent Distributors

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Northwest PG Solutions

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Overview

Elevate your projects with the BTA310-800D,127 TRIAC from NXP Semiconductors—where unmatched quality meets exceptional performance. Designed for reliable control of alternating currents, this component ensures optimum efficiency and durability across various applications, from lighting to motor control. Trust in NXP's renowned expertise to deliver a product that not only enhances system reliability but also simplifies your designs, empowering you to innovate without limits.

Feature Benefit Bullets

Maximum On-state Voltage: 1.5 V

A low on-state voltage signifies reduced power loss and increased efficiency during operation, making this TRIAC suitable for energy-sensitive applications.

Maximum DC Gate Trigger Current: 5 mA

A low gate trigger current means the TRIAC can be easily activated with minimal current draw, enhancing energy efficiency and compatibility with low-power control circuits.

Maximum Leakage Current: 0.5 mA

Low leakage current indicates better performance and reliability in applications where low standby power consumption is essential.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the TRIAC to function effectively in demanding environments, making it versatile for various applications.

Trigger Device Type: TRIAC

The TRIAC configuration enables bidirectional control of current, making it ideal for controlling AC loads efficiently.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliable performance in extreme cold conditions, expanding the TRIAC's application range.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures good solderability and corrosion resistance, enhancing durability and reliability during assembly and operation.

Maximum RMS On-state Current: 10 A

The ability to handle up to 10A rms makes it suitable for a wide range of medium-power applications, ensuring robust performance.

Maximum DC Gate Trigger Voltage: 1.5 V

A low gate trigger voltage indicates compatibility with various control devices, making it easier to integrate into existing systems.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage capacity ensures the TRIAC can handle significant voltage spikes, making it reliable for high-voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/µs

A high rate of rise of off-state voltage improves circuit protection against transient over-voltage, enhancing overall safety.

Maximum Holding Current: 10 mA

A low maximum holding current allows for quick turn-off after triggering, ensuring effective operation in control applications.

Technical Specifications

Triode For Alternating Current (TRIAC) BTA310-800D,127 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

10 mA

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Maximum On-state Voltage:

1.5 V

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum RMS On-state Current:

10 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Trigger Device Type:

Trade Compliance

BTA310-800D,127 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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