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MAC16HCNG

Onsemi

MAC16HCNG by Onsemi

MAC16HCNG by Onsemi is a TRIAC with 16A RMS on-state current, 800V repetitive peak off-state voltage, and 50mA max DC gate trigger current. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 622 parts In-Stock

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Vyrian

USA . 531 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$5.511

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$5.455

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$5.235

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500

$5.511

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$5.235

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Component Stockers USA

USA . 5,228 parts In-Stock

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$11.450

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A-Z Elektronik GmbH

Germany . 5,979 parts In-Stock

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Kulean Microsystems

USA . 5,161 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,986 parts In-Stock

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Problanco Electronics

Mexico . 3,658 parts In-Stock

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Corphita

USA . 2,291 parts In-Stock

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SupplyDigital Components

Austria . 1,894 parts In-Stock

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TANS Electronics

Latvia . 912 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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Corohmni

South Africa . 363 parts In-Stock

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Perfect Parts

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Overview

Upgrade your electronics with the MAC16HCNG by Onsemi, a high-quality TRIAC designed to provide reliable performance and efficiency. Onsemi is a trusted manufacturer known for producing top-of-the-line components, ensuring the durability and longevity of your devices. This versatile product is ideal for a wide range of applications, offering customers unparalleled value and benefits. Enhance your equipment with the MAC16HCNG and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 50 mA

Allows for reliable and precise triggering of the TRIAC, ensuring consistent performance.

Configuration: SINGLE

Simplifies the circuit design and installation process, making it easier to incorporate the TRIAC into various applications.

Maximum RMS On-state Current: 16 A

Capable of handling high currents, making it suitable for applications that require robust performance.

Repetitive Peak Off-state Voltage: 800 V

Provides high voltage tolerance, enabling the TRIAC to be used in a wide range of voltage applications.

Maximum Operating Temperature: 125 °C

Allows the TRIAC to operate in high-temperature environments without risk of overheating or performance degradation.

Minimum Operating Temperature: -40 °C

Maintains functionality even in low-temperature conditions, making it versatile for use in different climates.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC16HCNG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

750 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC16HCNG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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