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TPDV1240

STMicroelectronics

TPDV1240 by STMicroelectronics

TPDV1240 by STMicroelectronics is a TRIAC with a max RMS on-state current of 40A and a max DC gate trigger voltage of 1.5V. It is commonly used as an alternistor TRIAC in applications requiring high power switching, such as motor control and lighting systems.

Median Price

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8

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Digiode

USA . 2,578 parts In-Stock

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Anansix

USA . 2,504 parts In-Stock

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Vyrian

USA . 915 parts In-Stock

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Holdelec - ElecDif-Pro

France . 43 parts In-Stock

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ECAB

Sweden . 39 parts In-Stock

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LittleDiode

UK . 31 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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ComSIT Distribution GmbH

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IDEA Electronic Components Group

UK . 668 parts In-Stock

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$2.658

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$2.392

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MKK Technologies

India . 720 parts In-Stock

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$4.998

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DigiPath Technology Company

USA . 720 parts In-Stock

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$4.998

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AZTECH Wire

Italy . 557 parts In-Stock

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$12.213

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Ampacity Inc.

Singapore . 1,173 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Corphita

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Authorized Procurement Solutions

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Parana Technologies

USA . 3 parts In-Stock

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$3.178

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Overview

Experience the power of innovation with the TPDV1240 by STMicroelectronics, a high-quality Triode For Alternating Current (TRIAC) that delivers exceptional performance and reliability. Manufactured by STMicroelectronics, a leading technology company known for its cutting-edge solutions, this TRIAC offers countless applications in various industries. With its robust construction and advanced features, the TPDV1240 provides customers with unmatched value, benefits, and advantages. Say goodbye to inefficiencies and hello to seamless operation with the TPDV1240. Trust in STMicroelectronics and experience the future today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and offers good insulation properties, making it a reliable choice for various applications.

Maximum DC Gate Trigger Current: 200 mA

With a high maximum DC gate trigger current, this TRIAC allows for efficient and precise gating control, making it suitable for demanding AC applications.

Configuration: SINGLE

The single configuration simplifies circuit design and installation, making it convenient and space-saving in various electronic systems.

Package Shape: RECTANGULAR

The rectangular shape of the package provides compatibility with standardized mounting methods, allowing for straightforward and efficient installation and integration into electrical circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers a robust mechanical connection, enhancing reliability and facilitating easy soldering during assembly, making it suitable for rugged applications.

No. of Elements: 1

With a single element, this TRIAC offers simplicity and ease of use, eliminating the need for complex configurations and reducing overall system complexity.

Maximum Leakage Current: 5 mA

The low maximum leakage current ensures enhanced efficiency and reduces power wastage, making it an energy-efficient choice.

Maximum Repetitive Peak Off-state Leakage Current: 20 uA

The low maximum repetitive peak off-state leakage current contributes to the product's high reliability and helps prevent unintended current flow in off-state conditions.

No. of Terminals: 3

With three terminals, this TRIAC provides easier connectivity options and simplifies circuit design and installation, offering versatility in various electrical applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure and stable mounting options, ensuring proper heat dissipation and making it suitable for high-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable operation even in demanding environments, making it versatile for a wide range of applications.

Trigger Device Type: ALTERNISTOR TRIAC

The alternistor TRIAC type ensures robust and reliable switching performance, with the ability to handle high inrush currents, making it ideal for motor control and AC power switching applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables this TRIAC to operate reliably in extreme cold conditions, expanding its versatility in various environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and corrosion resistance, improving the product's overall lifespan and reliability.

Terminal Position: SINGLE

With a single terminal position, the TRIAC offers simplicity in connection and reduces the chance of wiring errors, leading to more reliable operation in various circuits.

Maximum RMS On-state Current: 40 A

The high maximum RMS on-state current capability enables this TRIAC to handle high-power loads efficiently, making it suitable for applications demanding substantial current carrying capacity.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC gate trigger voltage allows for compatibility with low-voltage control circuits, making it suitable for voltage-sensitive applications while ensuring accurate and reliable triggering.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety and protection against accidental contact and potential short circuits, making it a safe choice for different electrical systems.

Repetitive Peak Off-state Voltage: 1200 V

With a high repetitive peak off-state voltage, this TRIAC offers robust isolation and reliable performance, making it suitable for high-voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 0.00001 V/us

The low minimum critical rate of rise of commutation voltage ensures smooth and reliable switching performance, minimizing electromagnetic interference and improving overall system stability.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

The high minimum critical rate of rise of off-state voltage allows for rapid switching and enhanced transient voltage suppression, ensuring efficient operation in AC power control applications.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures compliance with safety and performance standards, providing peace of mind and assuring the product's reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) TPDV1240 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

.00001 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

200 mA

Maximum DC Gate Trigger Voltage:

1.5 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

40 A

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Off-state Leakage Current:

20 uA

Repetitive Peak Off-state Voltage:

1200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

TPDV1240 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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