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TPDV640RG

STMicroelectronics

TPDV640RG by STMicroelectronics

TPDV640RG by STMicroelectronics is a TRIAC with max. DC gate trigger current of 200mA, max. RMS on-state current of 40A, and repetitive peak off-state voltage of 600V. It is used in applications requiring isolated case connection, UL recognized reference standard, and operating temperatures from -40 °C to 125°C.

Median Price

$6.327

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 36 parts In-Stock

1+ parts

$6.327

100+ parts

$4.080

1k+ parts

$3.999

10k+ parts

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36

$6.327

$4.080

$3.999

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Arrow

USA . 36 parts In-Stock

1+ parts

$6.327

100+ parts

$4.080

1k+ parts

$3.999

10k+ parts

-

36

$6.327

$4.080

$3.999

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,602 parts In-Stock

1+ parts

$6.011

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1,602

$6.011

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Vyrian

USA . 5,066 parts In-Stock

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5,066

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Anansix

USA . 2,550 parts In-Stock

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2,550

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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ComSIT USA

USA . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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30

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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15

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LittleDiode

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 285 parts In-Stock

1+ parts

$1.961

100+ parts

-

1k+ parts

$1.764

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285

$1.961

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$1.764

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MKK Technologies

India . 1,444 parts In-Stock

1+ parts

$3.687

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1,444

$3.687

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DigiPath Technology Company

USA . 1,444 parts In-Stock

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$3.687

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1,444

$3.687

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Corphita

USA . 243 parts In-Stock

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$5.694

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243

$5.694

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Continental Prestige Electronics

USA . 149 parts In-Stock

1+ parts

$8.100

100+ parts

$5.070

1k+ parts

$3.700

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149

$8.100

$5.070

$3.700

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AZTECH Wire

Italy . 505 parts In-Stock

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$18.240

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505

$18.240

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QUARKTWIN TECHNOLOGY LTD

USA . 22,015 parts In-Stock

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Perfect Parts

USA . 4,094 parts In-Stock

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4,094

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Parana Technologies

USA . 1,419 parts In-Stock

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$2.344

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1,419

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$2.344

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iodParts Technologies Inc.

India . 300 parts In-Stock

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300

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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150

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Overview

Discover the superior quality and reliability of the TPDV640RG by STMicroelectronics, a leading manufacturer in the industry. As a Triode For Alternating Current (TRIAC), this product offers unparalleled performance and precision in various applications. With a maximum RMS On-state Current of 40A and Repetitive Peak Off-state Voltage of 600V, customers can trust in the durability and efficiency of this TRIAC. Whether used in lighting controls or motor speed regulation, the TPDV640RG delivers value, benefits, and advantages that exceed expectations. Elevate your projects with the trusted technology of STMicroelectronics.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 200 mA

High gate trigger current ensures reliable and stable operation of the TRIAC.

Configuration: SINGLE

Single configuration simplifies installation and integration into existing systems.

Maximum Leakage Current: 5 mA

Low leakage current helps in reducing power loss and improving efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for use in various environments and applications.

Trigger Device Type: TRIAC

TRIAC trigger device type provides precise control and switching capabilities.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions.

Maximum RMS On-state Current: 40 A

High on-state current capacity allows for handling of heavy loads.

Maximum DC Gate Trigger Voltage: 2.5 V

Low gate trigger voltage ensures efficient control of the TRIAC.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating makes the TRIAC suitable for high voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 0.00001 V/us

Low critical rate of rise of commutation voltage ensures smooth and stable switching.

Minimum Critical Rate of Rise of Off-state Voltage: 0.0002 V/us

Low critical rate of rise of off-state voltage minimizes the risk of false triggering and ensures reliable operation.

Reference Standard: UL RECOGNIZED

UL recognized certification guarantees the quality and safety of the product.

Technical Specifications

Triode For Alternating Current (TRIAC) TPDV640RG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

.00001 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

.0002 V/us

Maximum DC Gate Trigger Current:

200 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Leakage Current:

5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum RMS On-state Current:

40 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Trigger Device Type:

Trade Compliance

TPDV640RG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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