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TPDV825RG

STMicroelectronics

TPDV825RG by STMicroelectronics

TPDV825RG by STMicroelectronics is a TRIAC with 800V repetitive peak off-state voltage, 25A max RMS on-state current, and 150mA max DC gate trigger current. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,625 parts In-Stock

1+ parts

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4,625

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Vyrian

USA . 4,277 parts In-Stock

1+ parts

-

100+ parts

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4,277

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ComSIT Distribution GmbH

Germany . 480 parts In-Stock

1+ parts

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480

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Anansix

USA . 428 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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428

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$3.439

100+ parts

-

1k+ parts

$3.095

10k+ parts

-

788

$3.439

-

$3.095

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MKK Technologies

India . 1,738 parts In-Stock

1+ parts

$6.467

100+ parts

-

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1,738

$6.467

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DigiPath Technology Company

USA . 1,738 parts In-Stock

1+ parts

$6.467

100+ parts

-

1k+ parts

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1,738

$6.467

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AZTECH Wire

Italy . 181 parts In-Stock

1+ parts

$17.020

100+ parts

-

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181

$17.020

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Component Stockers USA

USA . 1,071 parts In-Stock

1+ parts

$92.820

100+ parts

-

1k+ parts

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10k+ parts

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1,071

$92.820

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Corphita

USA . 3,136 parts In-Stock

1+ parts

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3,136

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 739 parts In-Stock

1+ parts

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739

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Parana Technologies

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$4.112

1k+ parts

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10k+ parts

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72

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$4.112

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Overview

Unlock the power of innovation with the TPDV825RG by STMicroelectronics. This TRIAC offers unmatched quality and reliability, backed by the reputable manufacturer's expertise in cutting-edge technology. Ideal for a wide range of applications, this product provides customers with superior performance and durability. Experience seamless operation and enhanced efficiency with the TPDV825RG, making it the perfect choice for your next project. Elevate your designs with this top-of-the-line component and see the difference it can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the internal components of the TRIAC, ensuring durability and reliability.

Maximum DC Gate Trigger Current: 150 mA

The high maximum DC gate trigger current allows for efficient and reliable switching of the TRIAC, making it suitable for various applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easy to integrate the TRIAC into different systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can withstand harsh environmental conditions and performance requirements.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage ensures reliable operation and protection against voltage spikes and transients.

Technical Specifications

Triode For Alternating Current (TRIAC) TPDV825RG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

150 mA

Maximum DC Gate Trigger Voltage:

2.5 V

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

25 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TPDV825RG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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