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TPDV1025

STMicroelectronics

TPDV1025 by STMicroelectronics

TPDV1025 by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 25 A and a repetitive peak off-state voltage of 1000 V. It operates b/w -40 °C to 125°C with a gate trigger current of 150 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,036 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,036

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-

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Digiode

USA . 2,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,580

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-

-

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ACDS - Activité Composants Distribution Service

France . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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960

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-

-

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Anansix

USA . 300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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300

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-

-

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ECAB

Sweden . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 822 parts In-Stock

1+ parts

$2.946

100+ parts

-

1k+ parts

$2.651

10k+ parts

-

822

$2.946

-

$2.651

-

MKK Technologies

India . 1,418 parts In-Stock

1+ parts

$5.539

100+ parts

-

1k+ parts

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10k+ parts

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1,418

$5.539

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-

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DigiPath Technology Company

USA . 1,418 parts In-Stock

1+ parts

$5.539

100+ parts

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1k+ parts

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10k+ parts

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1,418

$5.539

-

-

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Kepictronics

USA . 3,500 parts In-Stock

1+ parts

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1k+ parts

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3,500

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Corphita

USA . 2,655 parts In-Stock

1+ parts

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1k+ parts

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2,655

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Parana Technologies

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$3.522

1k+ parts

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10k+ parts

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56

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$3.522

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Overview

Elevate your projects with the TPDV1025 from STMicroelectronics, a leader in innovation and quality. This TRIAC delivers reliable performance for a wide range of applications, ensuring smooth control of AC loads. With its robust design and excellent thermal stability, it minimizes leakage and enhances efficiency, providing outstanding value for both hobbyists and professionals. Trust in STMicroelectronics for unwavering quality that empowers your next big idea!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent insulation and resistance against environmental factors, ensuring long-lasting performance.

Maximum DC Gate Trigger Current: 150 mA

A relatively high maximum gate trigger current allows for effective control in applications, facilitating reliable switching and operation.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easy integration into various electrical setups.

Package Shape: RECTANGULAR

The rectangular shape enhances mounting options and makes it suitable for a variety of applications in compact spaces.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, ensuring reliable performance in high-stress environments.

Maximum Leakage Current: 2 mA

A low maximum leakage current minimizes energy loss, making this product more efficient for power management in circuits.

Maximum Repetitive Peak Off-state Leakage Current: 20 uA

The very low off-state leakage current enhances energy efficiency, benefiting applications where power conservation is critical.

No. of Terminals: 3

Having three terminals allows for versatile configurations, facilitating various control and switching applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers easy installation and stable mounting, suitable for industrial applications where reliability is paramount.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125 °C allows the TRIAC to function effectively in high-temperature environments, expanding application possibilities.

Trigger Device Type: ALTERNISTOR TRIAC

The TRIAC configuration offers efficient bidirectional current control, making it ideal for AC load switching applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range, from -40 °C to 125°C, ensures reliable performance in extreme conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish provides excellent solderability and corrosion resistance, enhancing the reliability of the connections.

Terminal Position: SINGLE

A single terminal position simplifies design layouts, making it easier to integrate into existing circuits.

Maximum RMS On-state Current: 25 A

With a high on-state current rating, this TRIAC can handle substantial loads, ensuring performance in demanding applications.

Maximum DC Gate Trigger Voltage: 1.5 V

The low gate trigger voltage allows for compatibility with low-voltage control circuits, enhancing versatility in applications.

Case Connection: ISOLATED

An isolated case connection enhances safety and minimizes the risk of electrical interference and short circuits.

Repetitive Peak Off-state Voltage: 1000 V

A high off-state voltage rating supports robust performance in high-voltage applications, ensuring reliability under demanding conditions.

Minimum Critical Rate of Rise of Commutation Voltage: 10 V/µs

This specification ensures the TRIAC can handle fast voltage transients, which is critical for applications with rapid switching requirements.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/µs

High response rate to off-state voltage enhances the TRIAC's suitability for applications requiring rapid switching and high performance.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures compliance with stringent safety standards, providing assurance of the product's quality and reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) TPDV1025 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

150 mA

Maximum DC Gate Trigger Voltage:

1.5 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Off-state Leakage Current:

20 uA

Repetitive Peak Off-state Voltage:

1000 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

TPDV1025 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

NSN

5961-14-444-5746, 5961144445746

NIIN

144445746

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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