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MAC12HCDG

Onsemi

MAC12HCDG by Onsemi

MAC12HCDG by Onsemi is a TRIAC with 12A RMS on-state current, 400V repetitive peak off-state voltage, and 50mA max DC gate trigger current. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

$1.806

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 40 parts In-Stock

1+ parts

$2.805

100+ parts

$2.553

1k+ parts

$2.300

10k+ parts

-

40

$2.805

$2.553

$2.300

-

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.806

1k+ parts

$0.669

10k+ parts

$0.596

350

-

$0.806

$0.669

$0.596

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,368 parts In-Stock

1+ parts

$0.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,368

$0.628

-

-

-

Vyrian

USA . 3,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,257

-

-

-

-

R&J Components

USA . 184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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184

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,524 parts In-Stock

1+ parts

$0.595

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$0.595

-

-

-

Corohmni

South Africa . 486 parts In-Stock

1+ parts

$0.661

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$0.661

-

-

-

Component Stockers USA

USA . 281 parts In-Stock

1+ parts

$0.680

100+ parts

$0.640

1k+ parts

-

10k+ parts

-

281

$0.680

$0.640

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$2.805

100+ parts

$2.553

1k+ parts

$2.300

10k+ parts

-

40

$2.805

$2.553

$2.300

-

Microchip USA

USA . 8,532 parts In-Stock

1+ parts

$4.095

100+ parts

-

1k+ parts

-

10k+ parts

-

8,532

$4.095

-

-

-

SupplyDigital Components

Austria . 7,454 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,454

-

-

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Problanco Electronics

Mexico . 7,063 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,063

-

-

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TANS Electronics

Latvia . 5,062 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,062

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

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Kepictronics

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,450

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-

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Kulean Microsystems

USA . 2,214 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,214

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UHIMA Technologies

Türkiye . 88 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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88

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-

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Overview

Enhance your electrical projects with the MAC12HCDG by Onsemi, a top-quality TRIAC designed for high-performance applications. Manufactured by Onsemi, a renowned leader in semiconductor technology, this TRIAC offers unmatched reliability and durability. With a maximum RMS on-state current of 12A and a repetitive peak off-state voltage of 400V, this TRIAC is ideal for a wide range of industrial and consumer electronics applications. Trust Onsemi to deliver exceptional quality and performance, making the MAC12HCDG the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for a variety of applications.

Maximum DC Gate Trigger Current: 50 mA

The high maximum DC gate trigger current allows for efficient and reliable triggering of the TRIAC, ensuring consistent performance.

Configuration: SINGLE

The single configuration simplifies the setup and installation process, making it user-friendly and easy to integrate into existing systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, enhancing the overall reliability of the product.

Maximum Leakage Current: 0.01 mA

The low maximum leakage current minimizes power loss and improves energy efficiency, making the product cost-effective in the long run.

No. of Terminals: 3

The three terminals offer flexibility in connection options, allowing for versatile use in different circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates easy mounting and installation, saving time and effort during setup.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making the product suitable for a wide range of applications.

Trigger Device Type: TRIAC

The TRIAC trigger device type offers precise control over switching applications, making the product ideal for AC power control and regulation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance, increasing the product's versatility.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and good conductivity, ensuring long-term reliability and stable operation.

Maximum RMS On-state Current: 12 A

The high maximum RMS on-state current capability allows for handling higher loads, making the product suitable for demanding power applications.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC gate trigger voltage requirement simplifies the control circuit design and reduces power consumption, enhancing the overall efficiency.

Case Connection: MAIN TERMINAL 2

The case connection to main terminal 2 ensures proper grounding and minimizes interference, improving the overall stability of the product.

Repetitive Peak Off-state Voltage: 400 V

The high repetitive peak off-state voltage rating allows for reliable operation in high voltage applications, making the product suitable for a wide range of power control functions.

Minimum Critical Rate of Rise of Commutation Voltage: 15 V/us

The minimum critical rate of rise of commutation voltage ensures fast and efficient switching, reducing the risk of voltage spikes and improving overall system stability.

Minimum Critical Rate of Rise of Off-state Voltage: 600 V/us

The high minimum critical rate of rise of off-state voltage capability enables rapid turn-off and high surge withstand capacity, enhancing the product's reliability in transient conditions.

Maximum Holding Current: 60 mA

The high maximum holding current ensures stable operation after triggering, preventing false turn-offs and improving the overall performance of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for efficient soldering processes during manufacturing, ensuring reliable connections and overall product quality.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC12HCDG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

15 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

600 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

60 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC12HCDG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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