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BT136S-600

NXP Semiconductors

BT136S-600 by NXP Semiconductors

BT136S-600 by NXP Semiconductors is a TRIAC with 600V repetitive peak off-state voltage and 4A max RMS on-state current. It features a 35mA max DC gate trigger current, making it suitable for applications requiring precise AC power control in various electronic devices. This single configuration device operates b/w -40°C to 125°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 7,422 parts In-Stock

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ComSIT Distribution GmbH

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VNN

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Digiode

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Anansix

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Vyrian

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Nova Conductors

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Aztec Data Supply Inc.

USA . 1,425 parts In-Stock

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$4.660

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One Stop Electronics

USA . 1,460 parts In-Stock

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AZTECH Wire

Italy . 313 parts In-Stock

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Ampacity Inc.

Singapore . 489 parts In-Stock

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RC Electronics

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

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Lixinc

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 4,480 parts In-Stock

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UNI Independent Distributors

Spain . 3,699 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Corphita

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Overview

Unlock the power of efficient electrical control with the BT136S-600 by NXP Semiconductors. This TRIAC offers reliability and quality that you can trust, thanks to its manufacturer's reputation for cutting-edge technology. Ideal for a wide range of applications, this product provides customers with seamless operation and peace of mind. Say goodbye to downtime and hello to enhanced performance with the BT136S-600.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and long-term reliability of the product.

Maximum DC Gate Trigger Current: 35 mA

High trigger current allows for reliable switching of the TRIAC under various load conditions.

Configuration: SINGLE

SINGLE configuration simplifies the design and integration of the TRIAC into electronic circuits.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

RECTANGULAR shape provides efficient use of space on the circuit board.

Maximum RMS On-state Current: 4 A

High on-state current rating allows the TRIAC to handle heavy loads without any issues.

Technical Specifications

Triode For Alternating Current (TRIAC) BT136S-600 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

100 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

15 mA

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Maximum Repetitive Peak Off-state Leakage Current:

500 uA

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

BT136S-600 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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