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MAC4DCMT4

Onsemi

MAC4DCMT4 by Onsemi

MAC4DCMT4 by Onsemi is a single TRIAC with 500mA DC gate trigger current and 4A RMS on-state current. It operates b/w -40 to 125 °C, suitable for AC power control applications. The package is surface mountable, with a max off-state voltage of 600V and holding current of 35mA.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 98 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

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$0.750

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$0.750

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Vyrian

USA . 2,195 parts In-Stock

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Digiode

USA . 1,545 parts In-Stock

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Prism Electronics

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Corohmni

South Africa . 261 parts In-Stock

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$1.150

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Ampacity Inc.

Singapore . 1,142 parts In-Stock

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$15.100

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,218 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,812 parts In-Stock

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TANS Electronics

Latvia . 4,439 parts In-Stock

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Problanco Electronics

Mexico . 3,257 parts In-Stock

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Kulean Microsystems

USA . 2,511 parts In-Stock

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Corphita

USA . 2,334 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 537 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Unlock the power of efficient and reliable switching with the MAC4DCMT4 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products like this Triode For Alternating Current (TRIAC) for a wide range of applications. With a maximum RMS On-state current of 4A and a repetitive peak off-state voltage of 600V, this TRIAC offers superior performance and durability. Say goodbye to worries about overheating or malfunctioning, as the MAC4DCMT4 boasts a maximum operating temperature of 125 °C and a minimum critical rate of rise of off-state voltage of 500V/us. Trust Onsemi to deliver value and reliability with every product, making your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum DC Gate Trigger Current: 500 mA

Allows for reliable and consistent triggering of the TRIAC, ensuring stable performance in various applications.

Configuration: SINGLE

Simplified single configuration makes it easier to integrate into circuits and reduces complexity in design.

Maximum RMS On-state Current: 4 A

Capable of handling high current loads, making it suitable for a wide range of switching applications.

Repetitive Peak Off-state Voltage: 600 V

Can withstand high voltage levels, providing a robust solution for controlling alternating current.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC4DCMT4 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

500 mA

Maximum DC Gate Trigger Voltage:

5 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Maximum Leakage Current:

.01 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC4DCMT4 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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