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MAC224A6

Onsemi

MAC224A6 by Onsemi

MAC224A6 by Onsemi is a TRIAC with 400V repetitive peak off-state voltage, 40A max RMS on-state current, and 50mA max DC gate trigger current. It is ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,417 parts In-Stock

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Digiode

USA . 2,237 parts In-Stock

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2,237

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Distributors (Availability)

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,618 parts In-Stock

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Problanco Electronics

Mexico . 6,084 parts In-Stock

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Kulean Microsystems

USA . 5,733 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,412 parts In-Stock

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SupplyDigital Components

Austria . 3,867 parts In-Stock

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TANS Electronics

Latvia . 2,274 parts In-Stock

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Corphita

USA . 1,543 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 867 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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Overview

Discover the power and reliability of the MAC224A6 by Onsemi, a top-of-the-line Triode For Alternating Current (TRIAC) that delivers superior performance in a variety of applications. With Onsemi's reputation for quality and innovation, you can trust that this product will exceed your expectations. From its easy installation to its efficient operation, the MAC224A6 offers unbeatable value and benefits to customers looking for a high-quality solution. Whether you're in need of a versatile TRIAC for industrial or commercial use, this product is sure to deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC.

Maximum DC Gate Trigger Current: 50 mA

Allows for efficient triggering of the TRIAC to control current flow.

Configuration: SINGLE

Simplifies the setup and operation of the TRIAC.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation of the TRIAC.

Maximum Leakage Current: 2 mA

Ensures minimal current leakage when the TRIAC is in the off state.

No. of Terminals: 3

Provides necessary connections for input and output of current.

Package Style (Meter): FLANGE MOUNT

Enables secure attachment of the TRIAC to a compatible device or circuit.

Maximum Operating Temperature: 125 °C

Allows for reliable operation in a wide range of temperature conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers precise and efficient control over the switching of the TRIAC.

Minimum Operating Temperature: -45 °C

Ensures the TRIAC can function in low temperature environments.

Terminal Finish: TIN

Provides a reliable and conductive surface for electrical connections.

Terminal Position: SINGLE

Simplifies the wiring and connection process for the TRIAC.

Maximum RMS On-state Current: 40 A

Allows the TRIAC to handle high levels of current flow when activated.

Maximum DC Gate Trigger Voltage: 2 V

Ensures efficient triggering with minimal voltage input.

Case Connection: MAIN TERMINAL 2

Provides a specific connection point for the main terminal of the TRIAC.

Repetitive Peak Off-state Voltage: 400 V

Handles high voltage levels when the TRIAC is in the off state.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/us

Ensures smooth and efficient switching between on and off states.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

Maintains stability and reliability during the off state operation.

Maximum Holding Current: 75 mA

Helps to maintain the on-state of the TRIAC after triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC224A6 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

40 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC224A6 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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