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MAC997A6RLRP

Onsemi

MAC997A6RLRP by Onsemi

MAC997A6RLRP by Onsemi is a single TRIAC with 3 terminals, featuring a max DC gate trigger current of 5 mA and a max RMS on-state current of 0.8 A. Ideal for applications requiring precise AC power control, such as dimmer switches and motor speed controls.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,160 parts In-Stock

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Digiode

USA . 909 parts In-Stock

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909

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TANS Electronics

Latvia . 3,084 parts In-Stock

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3,084

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SupplyDigital Components

Austria . 2,460 parts In-Stock

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2,460

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Problanco Electronics

Mexico . 2,139 parts In-Stock

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Corphita

USA . 1,026 parts In-Stock

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1,026

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UHIMA Technologies

Türkiye . 954 parts In-Stock

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954

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Kulean Microsystems

USA . 700 parts In-Stock

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700

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Corohmni

South Africa . 410 parts In-Stock

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Overview

Enhance your electronic projects with the MAC997A6RLRP by Onsemi, a top-quality TRIAC designed for reliability and performance. Onsemi is a trusted manufacturer known for producing innovative components that meet the highest industry standards. This versatile device is ideal for a wide range of applications, providing customers with seamless operation and optimal functionality. Experience the value and benefits of using this TRIAC in your designs, offering superior quality and efficiency that will take your projects to the next level. Elevate your creations with the MAC997A6RLRP from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the TRIAC, ensuring a long-lasting product life.

Maximum DC Gate Trigger Current: 5 mA

This low trigger current allows for efficient and reliable switching of the TRIAC, reducing power consumption and heat generation.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to integrate the TRIAC into various electronic systems.

Package Shape: ROUND

The round shape of the package allows for easy mounting and soldering onto circuit boards, contributing to a smooth assembly process.

Maximum Leakage Current: 0.01 mA

The low leakage current helps to minimize power loss and improve the overall efficiency of the TRIAC during operation.

No. of Terminals: 3

Having three terminals allows for easy connection and control of the TRIAC in a circuit, enhancing its usability and versatility.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact and space-saving form factor, making it suitable for applications with limited space constraints.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this TRIAC can withstand elevated temperatures, ensuring reliable performance in demanding environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

This type of trigger device offers precise and efficient control over the switching of the TRIAC, making it suitable for a wide range of applications.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for reliable soldering during the manufacturing process, ensuring a secure connection to the circuit board.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997A6RLRP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997A6RLRP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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