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TIC206B

Texas Instruments

TIC206B by Texas Instruments

TIC206B by Texas Instruments is a TRIAC with 3 terminals, max. DC gate trigger current of 5 mA, and max. RMS on-state current of 3 A. It operates b/w -40 to 110 °C and has a repetitive peak off-state voltage of 200 V. Ideal for AC power control applications due to its single configuration and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,483 parts In-Stock

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Digiode

USA . 3,100 parts In-Stock

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Halfin

Belgium . 25 parts In-Stock

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EMSNET

USA . 9 parts In-Stock

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Parana Technologies

USA . 1,447 parts In-Stock

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$3.148

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$3.668

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ChromeModa Solutions

Germany . 4,093 parts In-Stock

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$3.537

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$2.900

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IDEA Electronic Components Group

UK . 351 parts In-Stock

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$3.537

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$3.183

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One Stop Electronics

USA . 960 parts In-Stock

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$7.100

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$7.100

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AZTECH Wire

Italy . 761 parts In-Stock

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$7.135

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Corphita

USA . 4,083 parts In-Stock

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$3.189

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Assy Fe

Spain . 86 parts In-Stock

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Overview

Elevate your electronic projects with the TIC206B TRIAC by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers a high-performance product that is perfect for a variety of applications. Whether you're working on lighting control, motor speed regulation, or heating control, this TRIAC offers unmatched value and benefits. With a maximum RMS On-state current of 3A and a maximum leakage current of only 1mA, the TIC206B provides efficiency and precision in a compact and durable package. Upgrade your designs today with the TIC206B from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and high durability, making the product suitable for various applications.

Maximum DC Gate Trigger Current: 5 mA

Low trigger current allows for precise control and efficient operation of the TRIAC.

Configuration: SINGLE

Simplifies the design and integration of the TRIAC in circuits.

Package Shape: RECTANGULAR

Facilitates easy mounting and integration in different electronic systems.

Terminal Form: THROUGH-HOLE

Enables secure and reliable connection in PCBs.

Maximum Leakage Current: 1 mA

Low leakage current enhances the efficiency and reliability of the TRIAC.

No. of Terminals: 3

Standard number of terminals for TRIAC applications, ensuring compatibility with various systems.

Package Style (Meter): FLANGE MOUNT

Allows for easy mounting and secure installation in electronic devices.

Maximum Operating Temperature: 110 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers precise control and versatility in triggering the TRIAC.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, expanding its range of applications.

Maximum RMS On-state Current: 3 A

High current carrying capacity makes it suitable for medium-power applications.

Maximum DC Gate Trigger Voltage: 2 V

Low trigger voltage allows for efficient control and circuit design.

Case Connection: MAIN TERMINAL 2

Clearly labeled case connection for easy installation and integration.

Repetitive Peak Off-state Voltage: 200 V

Suitable for switching applications in various electronic systems.

Maximum Holding Current: 30 mA

Stable holding current ensures proper operation and reliability of the TRIAC.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC206B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

30 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

1 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

3 A

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC206B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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