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MAC08BT1

Onsemi

MAC08BT1 by Onsemi

MAC08BT1 by Onsemi is a single TRIAC with 4 terminals, capable of handling up to 0.8A RMS on-state current. It has a max DC gate trigger voltage of 2V and can operate in temperatures ranging from -40 °C to 110°C. Ideal for applications requiring precise AC switching control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,537 parts In-Stock

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Digiode

USA . 1,445 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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Prism Electronics

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Component Stockers USA

USA . 359 parts In-Stock

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$99.990

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Kepictronics

USA . 50,000 parts In-Stock

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TANS Electronics

Latvia . 7,075 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,808 parts In-Stock

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SupplyDigital Components

Austria . 4,198 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,872 parts In-Stock

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Problanco Electronics

Mexico . 3,379 parts In-Stock

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Kulean Microsystems

USA . 2,724 parts In-Stock

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Perfect Parts

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Corphita

USA . 2,133 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Glotronic Ltd.

UK . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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Corohmni

South Africa . 335 parts In-Stock

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Overview

Elevate your electronics with the MAC08BT1 by Onsemi, a top-of-the-line TRIAC that guarantees superior quality and unmatched performance. Manufactured by industry leader Onsemi, this product is designed to meet the highest standards of excellence. Ideal for a variety of applications, this TRIAC offers reliability and efficiency like no other. Enhance your projects with the value and benefits that only the MAC08BT1 can provide. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and helps in reducing the overall weight of the product.

Maximum DC Gate Trigger Current: 10 mA

The low DC gate trigger current requirement ensures efficient and reliable triggering of the TRIAC.

Configuration: SINGLE

The single configuration simplifies the circuit design and installation process.

Surface Mount: YES

The surface mount capability allows for easy integration into compact electronic devices.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the TRIAC in various circuit configurations.

Maximum RMS On-state Current: 0.8 A

The high maximum RMS on-state current rating allows the TRIAC to handle larger loads effectively.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC08BT1 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

1.5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

10 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Maximum Leakage Current:

.01 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

MAC08BT1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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