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BTA25H-600CW3G

Onsemi

BTA25H-600CW3G by Onsemi

BTA25H-600CW3G by Onsemi is a 4 quadrant logic level TRIAC with max RMS on-state current of 25A and repetitive peak off-state voltage of 600V. Ideal for AC power control applications, it has a max operating temp of 150 °C and min operating temp of -40°C.

Median Price

$3.521

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$6.120

100+ parts

-

1k+ parts

$3.505

10k+ parts

-

2,000

$6.120

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$3.505

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Verical

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.521

10k+ parts

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2,000

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$3.521

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Rochester

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

21

-

$1.930

$1.730

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,521 parts In-Stock

1+ parts

$1.450

100+ parts

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1,521

$1.450

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Digiode

USA . 1,146 parts In-Stock

1+ parts

$2.024

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1,146

$2.024

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Chip Stock

USA . 1,047 parts In-Stock

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1,047

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Distributors (Availability)

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Corohmni

South Africa . 321 parts In-Stock

1+ parts

$1.800

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321

$1.800

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Corphita

USA . 94 parts In-Stock

1+ parts

$1.917

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94

$1.917

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Component Stockers USA

USA . 28 parts In-Stock

1+ parts

$2.180

100+ parts

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28

$2.180

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QUARKTWIN TECHNOLOGY LTD

USA . 17,652 parts In-Stock

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17,652

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Perfect Parts

USA . 6,440 parts In-Stock

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6,440

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TANS Electronics

Latvia . 5,869 parts In-Stock

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5,869

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SupplyDigital Components

Austria . 5,657 parts In-Stock

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5,657

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,901 parts In-Stock

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2,901

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Northwest PG Solutions

USA . 1,981 parts In-Stock

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1,981

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Native Components

USA . 1,405 parts In-Stock

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1,405

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Problanco Electronics

Mexico . 525 parts In-Stock

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525

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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510

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Overview

Unleash the power of the BTA25H-600CW3G by Onsemi, a top-quality TRIAC from a trusted manufacturer. Perfect for a variety of applications, this product offers unmatched reliability and performance. With its advanced features and durable construction, customers can trust in its long-lasting value. Say goodbye to inefficiency and hello to seamless operation with the BTA25H-600CW3G. Elevate your projects with this high-quality component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the triac, ensuring long-term reliability.

Maximum DC Gate Trigger Current: 35 mA

Allows for precise control and triggering of the triac, ensuring smooth operation.

Configuration: SINGLE

Simplifies the design and installation process, making it easier to integrate the triac into a circuit.

Package Shape: RECTANGULAR

Facilitates easy mounting and positioning of the triac in various applications.

Terminal Form: THROUGH-HOLE

Ensures secure and reliable connections to the circuit board, minimizing the risk of disconnection or failure.

Maximum Leakage Current: 15 mA

Helps in reducing power loss and improving efficiency in the overall circuit.

No. of Terminals: 3

Simplifies the connection process and reduces the complexity of the circuit design.

Package Style (Meter): FLANGE MOUNT

Enables easy mounting and secure placement of the triac in various industrial applications.

Maximum Operating Temperature: 150 °C

Allows the triac to operate in high-temperature environments without any issues, ensuring reliable performance.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Offers versatile triggering options for different applications, making it adaptable to various control systems.

Minimum Operating Temperature: -40 °C

Enables the triac to operate in extremely low-temperature conditions, providing flexibility in a wide range of environments.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: SINGLE

Streamlines the connection process and simplifies the circuit layout, making it easier to integrate the triac into the system.

Maximum RMS On-state Current: 25 A

Allows for high current-carrying capacity, making it suitable for handling heavy loads in various applications.

Maximum DC Gate Trigger Voltage: 1.3 V

Ensures low voltage triggering, reducing the power consumption and improving efficiency of the circuit.

Case Connection: ISOLATED

Helps in preventing interference and noise in the circuit, ensuring signal integrity and reliable operation.

Repetitive Peak Off-state Voltage: 600 V

Provides high voltage capability, making it suitable for applications requiring high voltage handling capacity.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Ensures fast response and protection against voltage spikes, safeguarding the triac and the connected components.

Maximum Holding Current: 50 mA

Helps in maintaining the on-state current flow, ensuring stable operation and preventing false triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) BTA25H-600CW3G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

15 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTA25H-600CW3G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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