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BTA26-800BW

STMicroelectronics

BTA26-800BW by STMicroelectronics

BTA26-800BW by STMicroelectronics is a single TRIAC with 800V repetitive peak off-state voltage, 25A max RMS on-state current, and 50mA max DC gate trigger current. It is used in applications requiring snubberless TRIACs for AC power control at temperatures ranging from -40°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 8,203 parts In-Stock

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8,203

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Digiode

USA . 3,801 parts In-Stock

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3,801

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Vyrian

USA . 3,493 parts In-Stock

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3,493

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Anansix

USA . 1,874 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

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$4.048

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$3.643

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1,034

$4.048

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$3.643

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Aztec Data Supply Inc.

USA . 4,755 parts In-Stock

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$4.820

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$4.820

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Corohmni

South Africa . 227 parts In-Stock

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$4.840

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227

$4.840

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Ampacity Inc.

Singapore . 1,168 parts In-Stock

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$5.100

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$5.100

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MKK Technologies

India . 1,059 parts In-Stock

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$7.612

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$7.612

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DigiPath Technology Company

USA . 1,059 parts In-Stock

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$7.612

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AZTECH Wire

Italy . 559 parts In-Stock

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$11.091

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Semicontronic

India . 129 parts In-Stock

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$28.100

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$27.398

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$27.257

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$27.257

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Continental Prestige Electronics

USA . 6,831 parts In-Stock

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Corphita

USA . 4,796 parts In-Stock

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Argo Parts USA

USA . 4,113 parts In-Stock

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Parana Technologies

USA . 2,066 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the BTA26-800BW by STMicroelectronics, a leading manufacturer in the electronics industry. As a Triode For Alternating Current (TRIAC), this product offers versatile applications in various electronic devices. With a maximum RMS On-state Current of 25A and Repetitive Peak Off-state Voltage of 800V, the BTA26-800BW guarantees superior performance and efficiency. Trust in STMicroelectronics to deliver exceptional value and benefits to customers seeking high-quality electronic components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum DC gate trigger current, this product ensures reliable and efficient performance.

Configuration: SINGLE

The single configuration simplifies installation and usage of this product.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and compact design.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and easy soldering.

Maximum Leakage Current: 3 mA

The low maximum leakage current ensures energy efficiency and minimal power loss.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

With a low off-state leakage current, this product helps improve overall system efficiency.

No. of Terminals: 3

The 3 terminals provide necessary connections for operation and help simplify circuit design.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure installation and stable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless TRIAC design enhances reliability and reduces electromagnetic interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures long-term reliability.

Terminal Position: SINGLE

The single terminal position simplifies installation and maintenance of this product.

Maximum RMS On-state Current: 25 A

With a high maximum RMS on-state current, this product can handle heavy loads with ease.

Maximum DC Gate Trigger Voltage: 1.5 V

The low gate trigger voltage ensures efficient and precise control of the TRIAC.

Case Connection: ISOLATED

The isolated case connection enhances safety and prevents electrical hazards.

Repetitive Peak Off-state Voltage: 800 V

With a high off-state voltage rating, this product is suitable for high voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

The minimum critical rate of rise of off-state voltage ensures stable and reliable operation.

Maximum Holding Current: 75 mA

The high maximum holding current allows for secure latching of the TRIAC under various conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) BTA26-800BW attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

75 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

3 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTA26-800BW Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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