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MAC97A8RLRM

Onsemi

MAC97A8RLRM by Onsemi

MAC97A8RLRM by Onsemi is a TRIAC with 600V repetitive peak off-state voltage, 0.6A max RMS on-state current, and 5mA max DC gate trigger current. It is used in applications requiring a 4 quadrant logic level TRIAC for AC switching operations at temperatures ranging from -40 °C to 110°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,646 parts In-Stock

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Vyrian

USA . 1,636 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,258 parts In-Stock

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Kulean Microsystems

USA . 7,314 parts In-Stock

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TANS Electronics

Latvia . 5,802 parts In-Stock

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SupplyDigital Components

Austria . 5,429 parts In-Stock

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Problanco Electronics

Mexico . 2,458 parts In-Stock

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UHIMA Technologies

Türkiye . 788 parts In-Stock

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Corphita

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Corohmni

South Africa . 115 parts In-Stock

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Overview

Looking to upgrade your electronic devices with a reliable and efficient Triode For Alternating Current (TRIAC)? Look no further than the MAC97A8RLRM by Onsemi. With a reputation for high-quality components, Onsemi delivers top-notch performance and durability. This TRIAC is designed for a variety of applications, offering customers value and benefits like precise control and seamless operation. Trust Onsemi's expertise and choose the MAC97A8RLRM for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides a rugged and durable enclosure for the TRIAC, protecting it from external elements and ensuring longevity.

Maximum DC Gate Trigger Current: 5 mA

With a low maximum DC gate trigger current requirement of 5 mA, this TRIAC is easy to activate and control, making it suitable for a variety of applications.

Configuration: SINGLE

The single configuration of this TRIAC simplifies the setup and installation process, making it convenient for users to incorporate into their circuit designs.

Package Shape: ROUND

The round package shape allows for easy mounting and integration into different types of circuit layouts, providing versatility in application usage.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes soldering connections straightforward and secure, ensuring reliable performance in the circuit.

No. of Terminals: 3

Having 3 terminals simplifies the connection process, making it easier for users to incorporate the TRIAC into their circuit designs accurately.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers space-saving benefits and allows for efficient PCB layout, making it a practical choice for compact electronic designs.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature of 110 °C, this TRIAC can withstand elevated temperature environments, ensuring reliable performance in various conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC offers precise control and switching capabilities, making it suitable for a wide range of applications that require accurate and efficient operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the TRIAC can function effectively even in cold environments, expanding its usability across different temperature ranges.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring stable connections and reliable performance in the circuit.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom facilitates easy PCB mounting and soldering, making installation hassle-free and efficient.

Maximum RMS On-state Current: 0.6 A

With a high maximum RMS on-state current rating of 0.6A, this TRIAC can handle moderate to high current loads, making it suitable for various power control applications.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage requirement of 2V ensures that the TRIAC can be easily triggered with minimal control voltage, enhancing its usability in low-power applications.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage rating of 600V provides robust insulation and voltage handling capabilities, making this TRIAC suitable for high-voltage applications.

Maximum Holding Current: 10 mA

The maximum holding current of 10 mA ensures that the TRIAC can maintain conduction even after the gate current is removed, providing stable operation in the circuit.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC97A8RLRM attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Configuration:

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.6 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC97A8RLRM Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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