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MAC997B6RLRPG

Onsemi

MAC997B6RLRPG by Onsemi

MAC997B6RLRPG by Onsemi is a single TRIAC with 3 terminals, max. DC gate trigger current of 5mA, and max. RMS on-state current of 0.8A. Ideal for applications requiring a 4 quadrant logic level TRIAC, it operates b/w -40 to 110 °C and has a repetitive peak off-state voltage of 400V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,418 parts In-Stock

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Vyrian

USA . 2,394 parts In-Stock

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SupplyDigital Components

Austria . 6,766 parts In-Stock

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TANS Electronics

Latvia . 4,534 parts In-Stock

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Problanco Electronics

Mexico . 4,004 parts In-Stock

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Kulean Microsystems

USA . 2,933 parts In-Stock

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Corphita

USA . 1,828 parts In-Stock

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UHIMA Technologies

Türkiye . 812 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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Overview

Enhance your electronic devices with the MAC997B6RLRPG TRIAC by Onsemi, a reliable and high-quality component that guarantees seamless performance. Manufactured by Onsemi, a trusted name in the industry, this TRIAC is designed for various applications, offering customers unparalleled value and benefits. With its superior design and durability, this product ensures optimal functionality and efficiency, making it the perfect choice for any project requiring precision and reliability. Elevate your electronics with the MAC997B6RLRPG TRIAC and experience top-notch performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the TRIAC, making it durable and reliable for long-term use.

Maximum DC Gate Trigger Current: 5 mA

Low gate trigger current allows for easy and efficient control of the TRIAC, ensuring smooth operation in various applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and installation process, making the TRIAC an ideal choice for straightforward applications.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures the TRIAC can withstand extreme temperature conditions, making it suitable for a wide range of environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4-quadrant logic level TRIAC allows for bidirectional control of AC power, offering more versatility in controlling different types of loads.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997B6RLRPG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997B6RLRPG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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