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MAC3030-8

Onsemi

MAC3030-8 by Onsemi

MAC3030-8 by Onsemi is a TRIAC with 1.65V max on-state voltage, 75mA max DC gate trigger current, and 8A max RMS on-state current. Ideal for applications requiring precise AC power control in devices like dimmers, motor speed controllers, and heating controls.

Median Price

$1.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 59 parts In-Stock

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$1.700

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Digiode

USA . 2,251 parts In-Stock

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Vyrian

USA . 276 parts In-Stock

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Electronic Expediters

USA . 59 parts In-Stock

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59

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R&J Components

USA . 25 parts In-Stock

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Q Components

USA . 9 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 377 parts In-Stock

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$1.700

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Kulean Microsystems

USA . 8,383 parts In-Stock

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TANS Electronics

Latvia . 8,093 parts In-Stock

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SupplyDigital Components

Austria . 7,713 parts In-Stock

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Problanco Electronics

Mexico . 2,852 parts In-Stock

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Corphita

USA . 803 parts In-Stock

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UHIMA Technologies

Türkiye . 640 parts In-Stock

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Overview

Discover the power and reliability of the MAC3030-8 by Onsemi, a top-of-the-line TRIAC that boasts superior quality and performance. With a focus on precision engineering and innovative design, Onsemi delivers a product that exceeds industry standards. Ideal for a wide range of applications, this TRIAC ensures smooth and efficient operation in various electrical systems. Experience the value and benefits of the MAC3030-8 with its high on-state voltage, low off-state leakage current, and versatile configuration. Trust Onsemi to provide you with a high-quality solution that meets your needs and enhances your projects.

Feature Benefit Bullets

Maximum On-state Voltage: 1.65 V

Low on-state voltage allows for efficient switching and helps reduce power dissipation.

Maximum DC Gate Trigger Current: 75 mA

Relatively high gate trigger current ensures reliable and stable operation.

Repetitive Peak Reverse Voltage: 250 V

Able to handle high reverse voltages, making it suitable for various applications.

Maximum RMS On-state Current: 8 A

Capable of handling high on-state currents, making it suitable for power control applications.

Minimum Critical Rate of Rise of Off-state Voltage: 100 V/us

Fast rate of rise of off-state voltage allows for quick response and protection against voltage spikes.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC3030-8 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

100 V/us

Maximum DC Gate Trigger Current:

75 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Quick Connects Description:

G-MT1-2MT2

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Voltage:

1.65 V

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

250 V

Repetitive Peak Reverse Voltage:

250 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC3030-8 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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