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MAC320A8FP

Onsemi

MAC320A8FP by Onsemi

MAC320A8FP by Onsemi is a TRIAC with 600V repetitive peak off-state voltage, 20A max RMS on-state current, and 50mA max DC gate trigger current. It is used in applications requiring isolated case connection, such as motor control and lighting systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,787 parts In-Stock

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Digiode

USA . 2,225 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,733 parts In-Stock

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SupplyDigital Components

Austria . 6,951 parts In-Stock

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Problanco Electronics

Mexico . 4,534 parts In-Stock

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Perfect Parts

USA . 3,882 parts In-Stock

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TANS Electronics

Latvia . 3,321 parts In-Stock

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Kulean Microsystems

USA . 3,037 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,733 parts In-Stock

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Glotronic Ltd.

UK . 1,386 parts In-Stock

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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Corphita

USA . 76 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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Overview

Discover the MAC320A8FP by Onsemi, a top-quality TRIAC that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this device is perfect for a wide range of applications. With a maximum RMS on-state current of 20A and a repetitive peak off-state voltage of 600V, this TRIAC ensures smooth operation and efficient power control. The MAC320A8FP provides customers with the value they need, delivering superior benefits and advantages for their projects. Experience the difference with Onsemi's exceptional quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for a wide range of applications.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum gate trigger current, this TRIAC can be reliably triggered for efficient operation.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes installation easier.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and compact PCB layout in various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and easy soldering onto the PCB for a reliable connection.

Maximum Leakage Current: 2 mA

Low leakage current ensures efficient operation and minimizes power consumption in standby mode.

No. of Terminals: 3

With three terminals, this TRIAC can be easily integrated into different circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options for stability in various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can withstand elevated temperatures without compromising performance.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC allows for precise control and switching of AC loads in both directions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in diverse environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity for a reliable electrical connection.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of misconnections in the circuit.

Maximum RMS On-state Current: 20 A

With a high maximum on-state current rating, this TRIAC is capable of handling heavy loads with ease.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum gate trigger voltage ensures efficient triggering and control of the TRIAC for precise operation.

Case Connection: ISOLATED

The isolated case connection enhances safety and prevents electrical interference in the circuit.

Repetitive Peak Off-state Voltage: 600 V

With a high repetitive peak off-state voltage rating, this TRIAC can handle high voltage applications with ease.

Maximum Holding Current: 40 mA

The maximum holding current ensures the TRIAC remains in the on-state after triggering, providing stable operation.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC320A8FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

40 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC320A8FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

NSN

5961-01-459-8552, 5961014598552

NIIN

014598552

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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