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T1235H-600TRG

STMicroelectronics

T1235H-600TRG by STMicroelectronics

T1235H-600TRG by STMicroelectronics is a snubberless TRIAC with a max RMS on-state current of 12A and a repetitive peak off-state voltage of 600V. It is commonly used in applications requiring AC power control, such as lighting dimmers and motor speed control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,560 parts In-Stock

1+ parts

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4,560

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Digiode

USA . 2,873 parts In-Stock

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2,873

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Anansix

USA . 858 parts In-Stock

1+ parts

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858

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 775 parts In-Stock

1+ parts

$3.427

100+ parts

-

1k+ parts

$3.084

10k+ parts

-

775

$3.427

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$3.084

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$5.323

100+ parts

$4.844

1k+ parts

$4.365

10k+ parts

-

150

$5.323

$4.844

$4.365

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MKK Technologies

India . 1,205 parts In-Stock

1+ parts

$6.444

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1,205

$6.444

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DigiPath Technology Company

USA . 1,205 parts In-Stock

1+ parts

$6.444

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1,205

$6.444

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AZTECH Wire

Italy . 465 parts In-Stock

1+ parts

$9.810

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465

$9.810

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Ampacity Inc.

Singapore . 1,546 parts In-Stock

1+ parts

$20.100

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1,546

$20.100

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 4,899 parts In-Stock

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4,899

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Continental Prestige Electronics

USA . 4,734 parts In-Stock

1+ parts

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4,734

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A-Z Elektronik GmbH

Germany . 4,652 parts In-Stock

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4,652

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 1,827 parts In-Stock

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1,827

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Parana Technologies

USA . 1,055 parts In-Stock

1+ parts

-

100+ parts

$4.098

1k+ parts

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1,055

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$4.098

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Aranea Global

USA . 500 parts In-Stock

1+ parts

-

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500

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Overview

Discover the T1235H-600TRG by STMicroelectronics, a high-quality TRIAC designed to provide exceptional performance in a variety of applications. As a leading manufacturer in the industry, STMicroelectronics delivers products that exceed expectations, and this TRIAC is no exception. With its snubberless design and through-hole terminal form, it offers ease of use and reliability. Whether you're looking to control AC power in lighting systems or motor control applications, this TRIAC provides excellent value, benefits, and advantages. Trust STMicroelectronics to deliver the quality and performance you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the TRIAC, ensuring a longer lifespan and reliable performance.

Maximum DC Gate Trigger Current: 35 mA

High DC Gate Trigger Current allows for efficient and reliable triggering of the TRIAC, ensuring seamless operation.

Configuration: SINGLE

Single configuration simplifies the setup and integration of the TRIAC, making it user-friendly and easy to work with.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the TRIAC to withstand elevated temperatures, making it suitable for a wide range of environments and applications.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless TRIAC design reduces electromagnetic interference (EMI) and improves the overall stability of the system, making it a reliable choice for sensitive applications.

Technical Specifications

Triode For Alternating Current (TRIAC) T1235H-600TRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

5.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1235H-600TRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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