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T1235-800G

STMicroelectronics

T1235-800G by STMicroelectronics

T1235-800G by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 12 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125°C. Ideal for power switching applications in compact designs.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 7 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

10k+ parts

-

7

$2.310

$1.730

$1.500

-

Vyrian

USA . 4,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,797

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-

-

-

Anansix

USA . 2,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,652

-

-

-

-

Digiode

USA . 1,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,198

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,392 parts In-Stock

1+ parts

$2.385

100+ parts

-

1k+ parts

$2.146

10k+ parts

-

1,392

$2.385

-

$2.146

-

MKK Technologies

India . 616 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

616

$4.484

-

-

-

DigiPath Technology Company

USA . 616 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

616

$4.484

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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15,000

-

-

-

-

Corphita

USA . 3,186 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,186

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-

-

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Parana Technologies

USA . 2,068 parts In-Stock

1+ parts

-

100+ parts

$2.851

1k+ parts

-

10k+ parts

-

2,068

-

$2.851

-

-

Overview

Elevate your electronic designs with the T1235-800G TRIAC from STMicroelectronics, a powerhouse of reliability and performance. Crafted for efficiency in AC control applications, this compact surface-mount component ensures seamless operation even in demanding environments. With superior thermal stability and minimal leakage, it offers peace of mind and longevity. Choose STMicroelectronics for unmatched quality and innovation that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures the triac is lightweight and provides good resistance to environmental factors.

Maximum DC Gate Trigger Current: 35 mA

A moderate trigger current allows for easier drive capability while ensuring reliable operation in various applications.

Configuration: SINGLE

A single configuration simplifies circuit design and implementation, making it suitable for compact applications.

Surface Mount: YES

Surface mount technology enables efficient use of board space and simplifies automated assembly processes.

Package Shape: RECTANGULAR

A rectangular shape allows for easy integration into standard PCB layouts and thermal management.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering connections and stability on printed circuit boards.

Maximum Leakage Current: 0.005 mA

Low leakage current minimizes power loss and helps in achieving energy-efficient designs.

No. of Terminals: 2

Having only two terminals simplifies connections and reduces complexity in the circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package offers a compact solution suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for use in high-temperature environments, enhancing durability.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless design reduces component count and minimizes losses, making it ideal for low-noise applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability in extreme weather conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing connectivity.

Terminal Position: SINGLE

Single terminal position contributes to a simpler layout, reducing design complexity.

Maximum RMS On-state Current: 12 A

A high on-state current rating supports a wide range of load applications, from lighting to motor control.

Maximum DC Gate Trigger Voltage: 1.3 V

A low trigger voltage helps ensure compatibility with various control circuits and logic levels.

Case Connection: MAIN TERMINAL 2

Direct main terminal connection enhances efficiency in current flow and reduces overall electrical losses.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage capability makes this triac suitable for demanding applications requiring robust performance.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

A high critical rate of rise enhances the triac's ability to handle sudden changes in voltage, improving reliability.

Maximum Holding Current: 35 mA

The holding current capability allows for stable operation in low-power devices without premature turn-off.

Technical Specifications

Triode For Alternating Current (TRIAC) T1235-800G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T1235-800G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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