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T1235-600R

STMicroelectronics

T1235-600R by STMicroelectronics

T1235-600R by STMicroelectronics is a snubberless TRIAC designed for AC control applications. It features a max RMS on-state current of 12 A, repetitive peak off-state voltage of 600 V, and operates b/w -40 °C to 125 °C. Ideal for switching and motor control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,734 parts In-Stock

1+ parts

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4,734

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Digiode

USA . 3,105 parts In-Stock

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3,105

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Anansix

USA . 912 parts In-Stock

1+ parts

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912

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ComSIT Distribution GmbH

Germany . 259 parts In-Stock

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259

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ComSIT USA

USA . 259 parts In-Stock

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259

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 605 parts In-Stock

1+ parts

$3.877

100+ parts

-

1k+ parts

$3.489

10k+ parts

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605

$3.877

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$3.489

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MKK Technologies

India . 1,034 parts In-Stock

1+ parts

$7.290

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1,034

$7.290

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

$7.290

100+ parts

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1,034

$7.290

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Corphita

USA . 3,776 parts In-Stock

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3,776

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Parana Technologies

USA . 1,520 parts In-Stock

1+ parts

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100+ parts

$4.635

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1,520

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$4.635

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Overview

Unlock the power of reliable performance with the T1235-600R TRIAC from STMicroelectronics! This snubberless marvel is engineered for efficiency, offering exceptional control in a variety of AC applications—from motor drives to lighting systems. With ST's renowned quality and innovation, this TRIAC ensures durability and minimal leakage, maximizing your system's reliability and longevity. Trust in STMicroelectronics to elevate your projects with value-driven solutions that stand the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making this TRIAC suitable for various applications.

Maximum DC Gate Trigger Current: 35 mA

A maximum gate trigger current of 35 mA allows for efficient and reliable switching without excessive power loss.

Configuration: SINGLE

The single configuration simplifies design and integration into circuits, making it user-friendly for engineers.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure mounting and reliable electrical connections in various circuits.

Maximum Leakage Current: 0.005 mA

With a very low leakage current, this TRIAC minimizes energy loss in idle states, improving efficiency.

No. of Terminals: 3

Having three terminals allows for versatile connection options, enhancing functionality in different configurations.

Package Style (Meter): IN-LINE

The in-line packaging style supports easy assembly in automated processes, reducing manufacturing complexity.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability and performance in demanding environments.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces the need for external components, simplifying circuit design and increasing reliability.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this TRIAC to function well in cold environments, increasing its applicability.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces oxidation, ensuring a longer product lifecycle.

Terminal Position: SINGLE

Single terminal position simplifies the layout and design of circuits, leading to easier implementation.

Maximum RMS On-state Current: 12 A

With a capacity to handle up to 12 A of RMS on-state current, this TRIAC is suitable for high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

Low gate trigger voltage of 1.3 V improves energy efficiency and reduces the load on triggering circuits.

Case Connection: MAIN TERMINAL 2

A connection type featuring main terminal 2 enhances current handling capabilities, making it suitable for various applications.

Repetitive Peak Off-state Voltage: 600 V

A high repetitive peak off-state voltage of 600 V ensures reliable operation under demanding voltage conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

This specification indicates the TRIAC's ability to handle rapid voltage changes, making it robust against transient conditions.

Maximum Holding Current: 35 mA

The maximum holding current of 35 mA allows it to effectively control loads while maintaining low power consumption.

Technical Specifications

Triode For Alternating Current (TRIAC) T1235-600R attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1235-600R Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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