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TIC263B

Texas Instruments

TIC263B by Texas Instruments

TIC263B by Texas Instruments is a TRIAC with 25A RMS current, 200V repetitive peak off-state voltage, and 50mA max holding current. It operates b/w -40 to 110°C and has a trigger voltage of 2.5V. Ideal for AC power control applications requiring precise switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,762 parts In-Stock

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Digiode

USA . 2,383 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 654 parts In-Stock

1+ parts

$3.273

100+ parts

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$3.798

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654

$3.273

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$3.798

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DigiPath Technology Company

USA . 2,216 parts In-Stock

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$3.603

100+ parts

$3.315

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2,216

$3.603

$3.315

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ChromeModa Solutions

Germany . 4,913 parts In-Stock

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$3.677

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$3.015

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4,913

$3.677

$3.015

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IDEA Electronic Components Group

UK . 1,230 parts In-Stock

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$3.677

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$3.309

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1,230

$3.677

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$3.309

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Ampacity Inc.

Singapore . 643 parts In-Stock

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$8.100

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$8.100

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AZTECH Wire

Italy . 683 parts In-Stock

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$10.727

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One Stop Electronics

USA . 1,227 parts In-Stock

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$12.100

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Semicontronic

India . 194 parts In-Stock

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$13.100

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$12.772

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$12.707

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Corphita

USA . 3,506 parts In-Stock

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Corohmni

South Africa . 212 parts In-Stock

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Overview

Discover the power of the TIC263B by Texas Instruments, a high-quality TRIAC perfect for a wide range of applications. With its durable plastic/epoxy package body and single configuration, this device offers reliable performance with maximum DC gate trigger current of 50 mA. Ideal for controlling AC power in various systems, the TIC263B ensures smooth operation with its 4 quadrant logic level design. Trust Texas Instruments for superior products that deliver value, benefits, and advantages to customers seeking top-notch quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product durable and reliable for long-term use.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum DC gate trigger current of 50 mA, this TRIAC can reliably handle triggering requirements.

Configuration: SINGLE

Single configuration simplifies the setup and installation process.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier mounting and integration into various systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering.

Maximum Leakage Current: 2 mA

Low maximum leakage current of 2 mA ensures efficient operation and minimal power loss.

No. of Terminals: 3

Having 3 terminals provides flexibility in circuit design and connection options.

Package Style (Meter): FLANGE MOUNT

Flange mount package style simplifies the mounting process and adds stability to the overall design.

Maximum Operating Temperature: 110 °C

High maximum operating temperature of 110 °C allows for reliable performance in various environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level TRIAC provides precise and reliable triggering capabilities for different applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures the TRIAC can operate in extreme cold environments.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and ensures correct orientation.

Maximum RMS On-state Current: 25 A

High maximum RMS on-state current of 25 A allows the TRIAC to handle heavy loads with ease.

Maximum DC Gate Trigger Voltage: 2.5 V

Low maximum DC gate trigger voltage of 2.5 V reduces power consumption and improves efficiency.

Case Connection: MAIN TERMINAL 2

Main terminal 2 case connection provides a clear and organized layout for easy installation and maintenance.

Repetitive Peak Off-state Voltage: 200 V

High repetitive peak off-state voltage of 200 V offers a wide range of applications for the TRIAC.

Maximum Holding Current: 50 mA

High maximum holding current of 50 mA ensures stable operation and prevents unintended switching.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC263B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC263B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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