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MAC4DSM-001

Onsemi

MAC4DSM-001 by Onsemi

MAC4DSM-001 by Onsemi is a TRIAC with 600V repetitive peak off-state voltage and 4A max RMS on-state current. It has a 10mA max DC gate trigger current, making it suitable for AC power control applications. With a temperature range of -40 to 125 °C, it offers reliable performance in various environments.

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Vyrian

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Digiode

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$2.552

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$2.299

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

Mexico . 8,224 parts In-Stock

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Kulean Microsystems

USA . 6,599 parts In-Stock

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TANS Electronics

Latvia . 4,474 parts In-Stock

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SupplyDigital Components

Austria . 854 parts In-Stock

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UHIMA Technologies

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Corphita

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Corohmni

South Africa . 137 parts In-Stock

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Overview

With the MAC4DSM-001 by Onsemi, you can trust that you are getting a high-quality TRIAC that delivers reliable performance. Designed with precision and expertise by Onsemi, this product is perfect for a variety of applications. From lighting control to motor speed regulation, this TRIAC offers unmatched value and benefits to customers. Experience the advantages of easy installation, efficient operation, and long-lasting durability with the MAC4DSM-001. Elevate your projects with this top-tier product from a trusted manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection, making the product resistant to various environmental factors.

Maximum DC Gate Trigger Current: 10 mA

With a high maximum DC gate trigger current of 10 mA, this product ensures reliable and consistent triggering performance.

Configuration: SINGLE

The single configuration simplifies installation and wiring, making it easier to use and manipulate in various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space and easy mounting, making it suitable for compact setups.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and stable performance, reducing the risk of potential damage or disconnection.

Maximum Leakage Current: 2 mA

The low maximum leakage current of 2 mA helps in conserving power and preventing unnecessary wastage, making it energy-efficient.

No. of Terminals: 3

Having 3 terminals allows for versatile connection options, enabling flexibility in configurations and setups.

Package Style (Meter): IN-LINE

The in-line package style provides ease of integration and alignment in meter applications, ensuring accurate and reliable readings.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures stable performance even in extreme heat conditions, enhancing the product's reliability and longevity.

Trigger Device Type: TRIAC

Being a TRIAC trigger device provides precise control and efficient switching capabilities, making it suitable for a wide range of AC applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable performance in cold environments, ensuring consistent operation in various conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and reliable solder connections, enhancing the product's durability and performance.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection procedures, making it user-friendly and convenient to use.

Maximum RMS On-state Current: 4 A

With a maximum RMS on-state current of 4 A, this product can handle high current loads efficiently, making it suitable for various power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

The low maximum DC gate trigger voltage of 1.3 V allows for efficient and reliable triggering, ensuring proper operation and control.

Case Connection: MAIN TERMINAL 2

The case connection to main terminal 2 enhances safety and ensures proper grounding, minimizing the risk of electric shocks or malfunctions.

Repetitive Peak Off-state Voltage: 600 V

With a high repetitive peak off-state voltage of 600 V, this product can withstand high voltage conditions, making it suitable for demanding applications.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

The minimum critical rate of rise of off-state voltage of 50 V/us ensures fast and efficient switching, reducing the risk of voltage spikes and protecting connected devices.

Maximum Holding Current: 15 mA

The maximum holding current of 15 mA ensures stable operation and prevents unintended triggering, enhancing the product's reliability in various scenarios.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C enables reliable soldering and ensures strong connections, making the product robust and durable.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC4DSM-001 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC4DSM-001 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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