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TIC236B

Texas Instruments

TIC236B by Texas Instruments

TIC236B by Texas Instruments is a TRIAC with 12A RMS current, 200V repetitive peak off-state voltage, and 50mA DC gate trigger current. It is used in applications requiring 4-quadrant logic level TRIACs for AC switching tasks. Operating temperature ranges from -40 to 110°C, making it suitable for various industrial and consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,174 parts In-Stock

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Digiode

USA . 3,120 parts In-Stock

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3,120

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Distributors (Availability)

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Parana Technologies

USA . 829 parts In-Stock

1+ parts

$4.431

100+ parts

-

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$4.856

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829

$4.431

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$4.856

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ChromeModa Solutions

Germany . 5,638 parts In-Stock

1+ parts

$4.979

100+ parts

$4.083

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5,638

$4.979

$4.083

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

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$4.979

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$4.481

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$4.979

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AZTECH Wire

Italy . 365 parts In-Stock

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$11.313

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365

$11.313

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Ampacity Inc.

Singapore . 257 parts In-Stock

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$21.100

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257

$21.100

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Semicontronic

India . 1,043 parts In-Stock

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$24.100

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$23.498

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$23.377

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$24.100

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$23.377

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One Stop Electronics

USA . 1,449 parts In-Stock

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$27.100

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$27.100

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DigiPath Technology Company

USA . 1,132 parts In-Stock

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$4.489

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Corphita

USA . 1,060 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Assy Fe

Spain . 74 parts In-Stock

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Overview

Discover the power and reliability of the TIC236B by Texas Instruments, a top-of-the-line TRIAC designed for a wide range of applications. With Texas Instruments' reputation for quality and innovation, this TRIAC offers unmatched performance and durability. Whether you're looking to control AC power in lighting systems, motor speed controls, or heating applications, the TIC236B delivers seamless operation and precise control. Trust in Texas Instruments to provide you with the best-in-class components for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to high temperatures, making the product reliable for long-term use.

Maximum DC Gate Trigger Current: 50 mA

With a high gate trigger current, this product can quickly respond to control signals, providing efficient operation in various applications.

Configuration: SINGLE

The single configuration simplifies the installation process and reduces complexity in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and mounting of the product in a circuit board or system.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections to other components, ensuring reliable performance.

Maximum Leakage Current: 2 mA

The low leakage current ensures minimal power loss and improves the overall efficiency of the product.

No. of Terminals: 3

Having three terminals allows for versatile connectivity options, enabling the product to be used in a wide range of circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy installation and secure mounting in various systems or devices.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature, this product can withstand heat and perform reliably in challenging environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4-quadrant logic level TRIAC design provides precise control and accuracy in switching applications, making the product suitable for a wide range of uses.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments without compromising performance.

Terminal Position: SINGLE

The single terminal position simplifies wiring and installation, making the product user-friendly and easy to integrate into systems.

Maximum RMS On-state Current: 12 A

With a high maximum RMS on-state current, this product can handle heavy loads and deliver reliable performance in demanding applications.

Maximum DC Gate Trigger Voltage: 2.5 V

The low gate trigger voltage ensures efficient control and operation of the product, making it reliable and suitable for various circuit designs.

Case Connection: MAIN TERMINAL 2

The case connection to main terminal 2 provides a secure and stable electrical connection, ensuring optimal performance and reliability.

Repetitive Peak Off-state Voltage: 200 V

The high repetitive peak off-state voltage rating allows the product to handle high voltage levels without damage, ensuring safe and reliable operation.

Maximum Holding Current: 50 mA

The high maximum holding current ensures stable operation and prevents unintentional triggering, improving the overall performance and reliability of the product.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC236B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

200 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC236B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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