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BT137S-600E/T3

NXP Semiconductors

BT137S-600E/T3 by NXP Semiconductors

BT137S-600E/T3 by NXP Semiconductors is a TRIAC with 600V repetitive peak off-state voltage, 8A max RMS on-state current, and 10mA max DC gate trigger current. It is ideal for applications requiring precise AC power control in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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VNN

France . 33,545 parts In-Stock

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Anansix

USA . 2,836 parts In-Stock

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Digiode

USA . 2,304 parts In-Stock

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Vyrian

USA . 698 parts In-Stock

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698

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Nova Conductors

Japan . 54 parts In-Stock

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Prism Electronics

USA . 49 parts In-Stock

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49

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Corohmni

South Africa . 176 parts In-Stock

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$3.422

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Ampacity Inc.

Singapore . 1,648 parts In-Stock

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$4.100

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$4.100

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Semicontronic

India . 1,575 parts In-Stock

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$4.100

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$3.998

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$3.977

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1,575

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AZTECH Wire

Italy . 472 parts In-Stock

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$12.374

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472

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One Stop Electronics

USA . 1,225 parts In-Stock

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$16.100

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UNI Independent Distributors

Spain . 6,442 parts In-Stock

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Continental Prestige Electronics

USA . 5,843 parts In-Stock

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Corphita

USA . 4,125 parts In-Stock

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Argo Parts USA

USA . 531 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Perfect Parts

USA . 55 parts In-Stock

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Overview

Discover the superior quality and reliability of the BT137S-600E/T3 by NXP Semiconductors, a leading manufacturer in the industry. This Triode for Alternating Current (TRIAC) offers exceptional performance and efficiency in various applications. With a maximum RMS On-state current of 8A and a repetitive peak off-state voltage of 600V, this product provides unmatched value and benefits to customers. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations. Upgrade your electronics with the BT137S-600E/T3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and durability, making the product suitable for a wide range of applications.

Maximum DC Gate Trigger Current: 10 mA

Low DC gate trigger current ensures efficient and reliable operation of the TRIAC.

Configuration: SINGLE

Single configuration simplifies installation and integration of the TRIAC into electronic circuits.

Surface Mount: YES

Surface mount capability allows for easy and space-saving PCB mountings.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance even in demanding environments.

Maximum RMS On-state Current: 8 A

High on-state current rating allows the TRIAC to handle high load currents effectively.

Technical Specifications

Triode For Alternating Current (TRIAC) BT137S-600E/T3 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

20 mA

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Maximum Repetitive Peak Off-state Leakage Current:

500 uA

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

BT137S-600E/T3 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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