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2N6349G

Onsemi

2N6349G by Onsemi

2N6349G by Onsemi is a TRIAC with 800V repetitive peak off-state voltage and 8A max RMS on-state current. It operates b/w -40 °C to 125°C, suitable for 4 quadrant logic level TRIAC applications in various industries. The package style is flange mount with through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,013 parts In-Stock

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Vyrian

USA . 87 parts In-Stock

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SupplyDigital Components

Austria . 5,027 parts In-Stock

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Problanco Electronics

Mexico . 4,660 parts In-Stock

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TANS Electronics

Latvia . 4,582 parts In-Stock

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Kulean Microsystems

USA . 3,203 parts In-Stock

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Northwest PG Solutions

USA . 1,469 parts In-Stock

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UHIMA Technologies

Türkiye . 835 parts In-Stock

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835

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Corphita

USA . 715 parts In-Stock

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Native Components

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Enhance the performance of your electrical applications with the 2N6349G by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions in the Triode For Alternating Current category. This single configuration TRIAC boasts a maximum RMS on-state current of 8A and a repetitive peak off-state voltage of 800V, making it a versatile choice for a wide range of industrial and consumer electronics. Trust Onsemi to provide you with superior products that guarantee efficiency and durability, setting you up for success in any project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, increasing the reliability of the product.

Configuration: SINGLE

Having a single configuration simplifies installation and operation, making it user-friendly.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various systems or applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and easy soldering during assembly.

No. of Terminals: 3

With 3 terminals, this product offers a straightforward interface for connecting external components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables efficient heat dissipation and mechanical stability in a mounting system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in demanding environments without the risk of overheating.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC type provides precise control and reliable switching functionality in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function effectively in cold conditions without any performance issues.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and conductivity for stable connections and long-term performance.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces the chance of errors during connection.

Maximum RMS On-state Current: 8 A

With a maximum RMS on-state current of 8A, this product can handle high current loads efficiently and safely.

Case Connection: MAIN TERMINAL 2

The main terminal 2 case connection allows for easy integration into circuit designs and ensures proper functionality.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage rating of 800V provides reliable protection against voltage surges and transient events.

Technical Specifications

Triode For Alternating Current (TRIAC) 2N6349G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Repetitive Peak Off-state Voltage:

800 V

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

2N6349G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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