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MAC4DSMT4

Onsemi

MAC4DSMT4 by Onsemi

MAC4DSMT4 by Onsemi is a single TRIAC with 600V repetitive peak off-state voltage and 4A max RMS on-state current. It has a trigger voltage of 1.3V and operates b/w -40 to 125 °C, making it suitable for AC power control applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,121 parts In-Stock

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Digiode

USA . 953 parts In-Stock

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ComSIT Distribution GmbH

Germany . 712 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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TANS Electronics

Latvia . 6,868 parts In-Stock

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Kulean Microsystems

USA . 5,964 parts In-Stock

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SupplyDigital Components

Austria . 2,759 parts In-Stock

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Corphita

USA . 2,242 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,173 parts In-Stock

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UHIMA Technologies

Türkiye . 562 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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Problanco Electronics

Mexico . 258 parts In-Stock

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Overview

Experience the superior quality of Onsemi with the MAC4DSMT4, a high-performance TRIAC ideal for a wide range of applications. With a maximum RMS on-state current of 4A and a repetitive peak off-state voltage of 600V, this device offers unmatched reliability and efficiency. Whether you're looking to control AC power in home appliances, lighting systems, or industrial equipment, the MAC4DSMT4 delivers precise performance and peace of mind. Trust Onsemi's industry-leading expertise and elevate your projects with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 10 mA

Allows for reliable and consistent triggering of the TRIAC, making it suitable for various applications.

Configuration: SINGLE

Simplifies the design and integration of the TRIAC into electronic circuits.

Surface Mount: YES

Facilitates easy installation and mounting of the TRIAC on circuit boards.

Package Shape: RECTANGULAR

Optimizes space utilization on the circuit board, especially in compact designs.

Maximum RMS On-state Current: 4 A

Handles relatively high current levels, suitable for medium to high power applications.

Repetitive Peak Off-state Voltage: 600 V

Offers a high voltage rating, making the TRIAC suitable for applications requiring voltage control.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high temperature environments, increasing reliability and performance.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for reliable connections.

Maximum Holding Current: 15 mA

Ensures the TRIAC remains in the on-state even after the gate current is removed, important for certain applications.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC4DSMT4 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

15 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Maximum Leakage Current:

.01 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC4DSMT4 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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