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Z0103MN0

NXP Semiconductors

Z0103MN0 by NXP Semiconductors

Z0103MN0 by NXP Semiconductors is a TRIAC with 1A RMS on-state current and 600V repetitive peak off-state voltage. It is used as a trigger device in applications requiring 4 quadrant logic level TRIACs.

Median Price

$0.148

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 3,951 parts In-Stock

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-

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$0.148

1k+ parts

$0.128

10k+ parts

$0.104

3,951

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$0.148

$0.128

$0.104

Digiode

USA . 3,917 parts In-Stock

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Anansix

USA . 776 parts In-Stock

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776

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Vyrian

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328

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Nova Conductors

Japan . 99 parts In-Stock

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99

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Distributors (Availability)

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AZTECH Wire

Italy . 743 parts In-Stock

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$5.980

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One Stop Electronics

USA . 1,452 parts In-Stock

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$17.100

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Ampacity Inc.

Singapore . 456 parts In-Stock

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$18.100

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$18.100

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Lixinc

USA . 12,340 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,591 parts In-Stock

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Argo Parts USA

USA . 4,641 parts In-Stock

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Corphita

USA . 3,488 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,775 parts In-Stock

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Kepictronics

USA . 1,725 parts In-Stock

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Continental Prestige Electronics

USA . 1,171 parts In-Stock

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Aranea Global

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Overview

Experience the superior quality and reliability of NXP Semiconductors with the Z0103MN0. As a leading manufacturer, NXP Semiconductors offers innovative solutions to meet your needs. The Z0103MN0 is a TRIAC, perfect for various applications such as motor control and lighting systems. With its advanced design and exceptional performance, this product delivers unmatched value, benefits, and advantages to customers. Trust in NXP Semiconductors and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the TRIAC, making it a reliable choice for various applications.

Configuration: SINGLE

The single configuration allows for easy integration and installation in circuit designs, offering simplicity and convenience for users.

Surface Mount: YES

The surface mount capability enables effortless assembly onto PCBs, reducing production time and costs, making it a highly efficient choice for manufacturers.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space utilization, allowing for compact designs and efficient PCB layouts, ideal for space-constrained applications.

Terminal Form: GULL WING

The gull-wing terminal form provides excellent solderability and mechanical strength, ensuring secure connections, and enhancing the overall performance of the product.

No. of Elements: 1

With a single element, the TRIAC simplifies circuit designs and reduces complexity, enhancing reliability and making it an excellent choice for diverse electronic applications.

No. of Terminals: 4

The four terminals provide flexibility in circuit connections, allowing for easy integration and compatibility with various setups, making it a versatile choice for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact device designs, making it suitable for space-limited environments and ensuring ease of integration in a wide range of products.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this TRIAC can withstand high-temperature environments, guaranteeing reliable performance even in demanding applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC provides precise control and efficient switching capabilities, making it an excellent choice for applications where accurate power regulation is essential.

Terminal Finish: TIN

The tin terminal finish ensures excellent conductivity and corrosion resistance, improving the overall lifespan and performance of the TRIAC, making it a durable and cost-effective option.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit connections and allows for optimal compatibility with various circuit configurations, enhancing the versatility and usability of the product.

Maximum RMS On-state Current: 1 A

With a maximum RMS on-state current of 1 ampere, this TRIAC is capable of handling moderate power loads, making it suitable for diverse applications that require reliable current control.

Case Connection: MAIN TERMINAL 2

The case connection on main terminal 2 ensures secure mechanical mounting and efficient thermal dissipation, enhancing the TRIAC's reliability and performance in demanding conditions.

Repetitive Peak Off-state Voltage: 600 V

With a repetitive peak off-state voltage of 600 volts, this TRIAC provides robust isolation and voltage handling capabilities, making it suitable for applications where high voltage requirements are present.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0103MN0 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from NXP Semiconductors

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1 A

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0103MN0 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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