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TIC216M

Texas Instruments

TIC216M by Texas Instruments

TIC216M by Texas Instruments is a TRIAC with 600V repetitive peak off-state voltage, 6A max RMS on-state current, and 5mA max DC gate trigger current. It operates b/w -40°C to 110°C, making it suitable for AC power control applications like dimmers and motor speed controllers.

Median Price

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Lifecycle Status

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12

In-Stock Inventory

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Vyrian

USA . 8,208 parts In-Stock

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Halfin

Belgium . 3,220 parts In-Stock

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ComSIT Distribution GmbH

Germany . 151 parts In-Stock

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Pegasus Components GmbH

Germany . 149 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Huijzer Components

Netherlands . 87 parts In-Stock

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ECAB

Sweden . 77 parts In-Stock

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Digiode

USA . 74 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 46 parts In-Stock

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Manotoh

Italy . 44 parts In-Stock

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LittleDiode

UK . 17 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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One Stop Electronics

USA . 1,521 parts In-Stock

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$0.100

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Parana Technologies

USA . 197 parts In-Stock

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$3.518

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$4.043

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DigiPath Technology Company

USA . 154 parts In-Stock

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$3.874

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ChromeModa Solutions

Germany . 2,956 parts In-Stock

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$3.953

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$3.241

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IDEA Electronic Components Group

UK . 3 parts In-Stock

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$3.558

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AZTECH Wire

Italy . 760 parts In-Stock

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$13.438

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Kepictronics

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,850 parts In-Stock

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Corphita

USA . 1,820 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Assy Fe

Spain . 35 parts In-Stock

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Overview

Experience the power of the TIC216M by Texas Instruments, a high-quality TRIAC device designed to deliver superior performance in a variety of applications. With a maximum RMS on-state current of 6A and a repetitive peak off-state voltage of 600V, this TRIAC offers reliability and efficiency that you can trust. From controlling lighting systems to regulating motor speed, the TIC216M is your go-to solution for precision control. Trust in Texas Instruments' expertise to bring you cutting-edge technology that enhances your projects and simplifies your processes. Choose the TIC216M for unmatched value and unbeatable results.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 5 mA

Low gate trigger current allows for efficient and precise control of the switching action, resulting in reliable performance.

Maximum Leakage Current: 2 mA

Low leakage current ensures minimal power loss during off-state, improving overall energy efficiency.

Maximum Operating Temperature: 110 °C

High operating temperature tolerance enables the TRIAC to function effectively in demanding environments without risk of overheating.

Trigger Device Type: TRIAC

The TRIAC design provides bidirectional control of current flow, making it suitable for various AC power control applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both cold and hot climates, ensuring versatility in different settings.

Maximum RMS On-state Current: 6 A

High on-state current rating allows the TRIAC to handle heavy loads and deliver consistent performance under high-power conditions.

Maximum DC Gate Trigger Voltage: 2.2 V

Low gate trigger voltage requirement makes it easy to drive the TRIAC with low-power control signals, enhancing compatibility with various control circuits.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage capability ensures reliable isolation between input and output circuits, making the TRIAC suitable for high-voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/us

Fast rate of rise of commutation voltage enhances the switching speed and efficiency of the TRIAC, enabling quick and precise control of power flow.

Maximum Holding Current: 30 mA

High holding current ensures the TRIAC remains latched in its conducting state, improving stability and reliability during continuous operation.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC216M attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2.2 V

Maximum Holding Current:

30 mA

Maximum Leakage Current:

2 mA

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC216M Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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