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MAC997B6

Onsemi

MAC997B6 by Onsemi

MAC997B6 by Onsemi is a TRIAC with 3 terminals and a max RMS on-state current of 0.8A. It operates b/w -40 to 110 °C, with a repetitive peak off-state voltage of 400V. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,308 parts In-Stock

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2,308

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Digiode

USA . 499 parts In-Stock

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499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$2.361

100+ parts

$2.149

1k+ parts

$1.936

10k+ parts

-

600

$2.361

$2.149

$1.936

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QUARKTWIN TECHNOLOGY LTD

USA . 23,988 parts In-Stock

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23,988

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Kulean Microsystems

USA . 6,199 parts In-Stock

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6,199

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Problanco Electronics

Mexico . 5,830 parts In-Stock

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5,830

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Corphita

USA . 1,707 parts In-Stock

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1,707

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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600

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Corohmni

South Africa . 498 parts In-Stock

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498

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TANS Electronics

Latvia . 197 parts In-Stock

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197

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SupplyDigital Components

Austria . 116 parts In-Stock

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116

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Overview

Unlock the power of seamless control with the MAC997B6 by Onsemi. Crafted with precision and expertise, this TRIAC offers unparalleled reliability and performance in a variety of applications. From lighting controls to motor speed regulation, this product delivers superior quality and efficiency. With a focus on value and customer satisfaction, Onsemi ensures that every purchase of the MAC997B6 brings convenience and peace of mind. Trust in Onsemi for innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, ideal for various electronic applications.

Maximum DC Gate Trigger Current: 5 mA

Allows for precise triggering and control of the device.

Configuration: SINGLE

Simplified design for easier integration and operation.

Package Shape: ROUND

Facilitates easy installation and mounting in various systems.

Terminal Form: THROUGH-HOLE

Ensures reliable connections and easy soldering during assembly.

Maximum Leakage Current: 0.01 mA

Ensures minimal power loss and efficient performance.

No. of Terminals: 3

Simplified connection setup for ease of installation and use.

Package Style (Meter): CYLINDRICAL

Compact design for space-saving and versatile application.

Maximum Operating Temperature: 110 °C

Can withstand high temperatures for reliable performance in various environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Allows for versatile triggering options and compatibility with different systems.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, enhancing product flexibility.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and ensures long-term reliability.

Terminal Position: BOTTOM

Simplifies installation and maintenance procedures.

Maximum RMS On-state Current: 0.8 A

Capable of handling high current loads for various applications.

Maximum DC Gate Trigger Voltage: 2 V

Low trigger voltage requirement for efficient control and operation.

Repetitive Peak Off-state Voltage: 400 V

Provides high voltage tolerance for robust performance in demanding conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

Limits voltage spike risks and enhances the device's reliability.

Maximum Holding Current: 10 mA

Ensures device remains in the on-state, enhancing stability during operation.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997B6 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997B6 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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