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LV8747T-TLM-E

Onsemi

LV8747T-TLM-E by Onsemi

LV8747T-TLM-E by Onsemi is a Motion Control IC with 64 terminals, operating at -20 to 85 °C. It has a supply voltage of 24V and max current of 8mA. Ideal for applications requiring precise motion control in various industries.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 7,842 parts In-Stock

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Digiode

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 265 parts In-Stock

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$9.000

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Component Stockers USA

USA . 551 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,925 parts In-Stock

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Problanco Electronics

Mexico . 6,908 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 4,677 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 2,504 parts In-Stock

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Perfect Parts

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Corphita

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Metaverse IC Inc.

Canada . 1,023 parts In-Stock

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Kepictronics

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Cyclops Electronics Ltd (Excess)

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Corohmni

South Africa . 399 parts In-Stock

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Microchip USA

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Overview

Unleash the power of precise motion control with the LV8747T-TLM-E by Onsemi. Crafted with top-quality materials and cutting-edge BICMOS technology, this motion control IC offers unparalleled performance and reliability. From robotics to industrial automation, this versatile product caters to a wide range of applications, delivering smooth and efficient operation every time. Trust in Onsemi's expertise and elevate your projects with the LV8747T-TLM-E - a game-changer in the world of motion control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, ensuring the product is long-lasting and easy to handle.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 24V

Operating at a nominal supply voltage of 24V provides sufficient power for the motion control IC to function efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can operate reliably even in harsh environments with elevated temperatures.

Technology: BICMOS

Utilizing BiCMOS technology ensures fast operation and low power consumption, making the product energy-efficient and high-performing.

Technical Specifications

Motion Control ICs LV8747T-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP64,.35SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

8 mA

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

LV8747T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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