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LV8712T-MPB-H

Onsemi

LV8712T-MPB-H by Onsemi

LV8712T-MPB-H by Onsemi is a Motion Control IC with 24 terminals, operating at -20 to 85 °C. It features power supplies of 3.3V and 12V, BICMOS technology, and GULL WING terminal form. Ideal for applications requiring precise motion control in compact spaces.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25 parts In-Stock

1+ parts

$1.950

100+ parts

$1.830

1k+ parts

$1.650

10k+ parts

-

25

$1.950

$1.830

$1.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 311 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

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311

$1.852

-

-

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Vyrian

USA . 3,428 parts In-Stock

1+ parts

-

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3,428

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Distributors (Availability)

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Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

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25

$1.660

-

-

-

Corphita

USA . 641 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

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641

$1.755

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-

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Corohmni

South Africa . 480 parts In-Stock

1+ parts

$1.950

100+ parts

-

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480

$1.950

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-

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$21.250

100+ parts

-

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685

$21.250

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$28.123

100+ parts

$25.592

1k+ parts

$23.061

10k+ parts

-

1,000

$28.123

$25.592

$23.061

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QUARKTWIN TECHNOLOGY LTD

USA . 25,576 parts In-Stock

1+ parts

-

100+ parts

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25,576

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TANS Electronics

Latvia . 8,006 parts In-Stock

1+ parts

-

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8,006

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Problanco Electronics

Mexico . 6,005 parts In-Stock

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6,005

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SupplyDigital Components

Austria . 4,715 parts In-Stock

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4,715

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Kulean Microsystems

USA . 4,455 parts In-Stock

1+ parts

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4,455

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UHIMA Technologies

Türkiye . 691 parts In-Stock

1+ parts

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691

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Microchip USA

USA . 241 parts In-Stock

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241

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Enhance your motion control applications with the LV8712T-MPB-H by Onsemi. Crafted with precision and quality, this product offers unmatched reliability and performance. Designed for ease of use, this motion control IC boasts a compact package body and surface mount capability, making it ideal for a wide range of projects. Trust in Onsemi's expertise and elevate your designs with the LV8712T-MPB-H, delivering value and efficiency to satisfy all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Power Supplies (V): 3.3,12

Support for multiple power supply voltages provides flexibility in system design.

No. of Terminals: 24

Having a high number of terminals allows for more connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Terminal Finish: TIN BISMUTH

The use of tin bismuth terminal finish offers improved solderability and durability.

Technology: BICMOS

Utilizing BICMOS technology results in a high level of integration and low power consumption.

Technical Specifications

Motion Control ICs LV8712T-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

1.7 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LV8712T-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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