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PMCT8316Z0TRGFR

Texas Instruments

PMCT8316Z0TRGFR by Texas Instruments

PMCT8316Z0TRGFR by Texas Instruments is a Motion Control IC with 40 terminals, operating voltage range of 4.5V to 35V, and max output current of 8A. Ideal for automotive applications due to its temperature grade and brushless DC motor controller type. Package style includes chip carrier, heat sink/slug, and very thin profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,692 parts In-Stock

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Digiode

USA . 3,670 parts In-Stock

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Nova Conductors

Japan . 75 parts In-Stock

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Ampacity Inc.

Singapore . 966 parts In-Stock

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$1.500

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966

$1.500

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Semicontronic

India . 712 parts In-Stock

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$5.500

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$5.362

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$5.335

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712

$5.500

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One Stop Electronics

USA . 488 parts In-Stock

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$5.500

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488

$5.500

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$8.176

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$7.767

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$7.767

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$8.176

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$7.767

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Corohmni

South Africa . 237 parts In-Stock

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$13.208

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AZTECH Wire

Italy . 579 parts In-Stock

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$17.069

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Parana Technologies

USA . 1,716 parts In-Stock

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$17.105

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$17.320

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DigiPath Technology Company

USA . 20 parts In-Stock

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$18.835

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$18.835

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ChromeModa Solutions

Germany . 4,662 parts In-Stock

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$19.219

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$15.760

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$19.219

$15.760

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IDEA Electronic Components Group

UK . 788 parts In-Stock

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$19.219

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$18.258

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$17.297

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788

$19.219

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Corphita

USA . 3,560 parts In-Stock

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Argo Parts USA

USA . 3,311 parts In-Stock

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Continental Prestige Electronics

USA . 1,510 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience unmatched performance and reliability with the PMCT8316Z0TRGFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Motion Control ICs like no other. Perfect for automotive applications, this Brushless DC Motor Controller offers unparalleled value and benefits. With a wide operating temperature range and high output current, this product ensures smooth and efficient operation, making it the ideal choice for all your motion control needs. Upgrade to Texas Instruments today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 24 V

Suitable for a wide range of applications and provides sufficient power for the motion control IC to operate efficiently.

Maximum Operating Temperature: 125 °C

Allows the IC to withstand high temperatures, making it suitable for use in various industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without any issues, making it a versatile choice for different applications.

Maximum Output Current: 8 A

Capable of handling high current outputs, making it suitable for powering motors and other devices that require high power.

Technical Specifications

Motion Control ICs PMCT8316Z0TRGFR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

27 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

PMCT8316Z0TRGFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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